Features: • Isolated Package• High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz)• Sink to Lead Creepage Distance = 4.8 mm• 175 Operating Temperature• Dynamic dv/dt Rating• Low Thermal Resistance• Lead (Pb)-free AvailableSpecifications PARAMET...
SiHFIZ14G: Features: • Isolated Package• High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz)• Sink to Lead Creepage Distance = 4.8 mm• 175 Operating Temperature• Dynamic dv/...
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|
PARAMETER |
SYMBOL |
LIMIT |
UNIT | ||
|
Gate-Source Voltage |
VGS |
± 20 |
V | ||
|
Continuous Drain Current |
VGS at 10 V |
TC = 25 |
ID |
8.0 |
A |
|
TC = 100 |
5.7 | ||||
|
Pulsed Drain Currenta |
IDM |
32 | |||
|
Linear Derating Factor |
0.18 |
W/ | |||
|
Single Pulse Avalanche Energyb |
EAS |
47 |
mJ | ||
|
Maximum Power Dissipation |
TC = 25 |
PD |
27
|
W | |
|
Peak Diode Recovery dV/dtc |
dV/dt |
4.5 |
V/ns | ||
|
Operating Junction and Storage Temperature Range |
TJ, Tstg |
- 55 to + 175 |
|||
|
Soldering Recommendations (Peak Temperature) |
for 10 s |
300d | |||
|
Mounting Torque |
6-32 or M3 screw |
10 |
lbf ` in | ||
|
1.1 |
N ` m | ||||
Third deneration Power MOSFETs from Vishay provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing.