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TCDT1GW

Features: • Leadless chip form, no lead damage• Lead-free solder joint, no wire bond & lead frame• Low profile package• For surface mounted applications• Built-in strain relief• Low power loss, High efficiency• High current capability• High surge...

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SeekIC No. : 004515501 Detail

TCDT1GW: Features: • Leadless chip form, no lead damage• Lead-free solder joint, no wire bond & lead frame• Low profile package• For surface mounted applications• Built-in s...

TCDT1GW Data Sheet

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Part Number:
TCDT1GW
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/13

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Product Details

Description



Features:

• Leadless chip form, no lead damage
• Lead-free solder joint, no wire bond & lead frame
• Low profile package
• For surface mounted applications
• Built-in strain relief
• Low power loss, High efficiency
• High current capability
• High surge capacity
• Plastic package has UL Flammability Classification 94V-0
• RoHS Compliance


Specifications

Symbol Description TCDT
1DW		 TCDT
1GW		 TCDT
1JW		 TCDT
1KW		 TCDT
1MW		 Unit Conditions
VRRM Max. Repetitive Peak Reverse Voltage 200 400 600 800 1000 V  
VRMS Max. RMS Voltage 140 280 420 560 700 V  
VDC Max. DC Blocking Voltage 200 400 600 800 1000 V  
IF(AV) Average Forward Rectified Current 1.0 A See Fig.1
IFSM Peak Forward Surge Current 30 A 8.3ms single half
sine-wave
superimposed on
rated load
(JEDEC Method)
VF Max. Instantaneous Forward Voltage 1.0 V IF=1.0A



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