Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3.6 V: 90 ns Max Access Time- 3.0 V3.6 V: 80 ns Max Access Time` Optimized Block Sizes- Eight 8-KB Blo...
TE28F400B3B110: Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3....
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Features: ` Intel SmartVoltage Technology- 5V or 12V Program/Erase- 2.7V, 3.3V or 5V Read Operatio...
DescriptionThe TE28F800B3BA90 is designed as one kind of smart 3 advanced boot block 4-, 8-, 16-, ...
DescriptionThe TE28F320C3TC90 is designed as one kind of Intel Advanced+ Book Block Flash Memory (...
The Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.25 technology, represents a featurerich olution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball BGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flash.