TE28F400B3B110

Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3.6 V: 90 ns Max Access Time- 3.0 V3.6 V: 80 ns Max Access Time` Optimized Block Sizes- Eight 8-KB Blo...

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SeekIC No. : 004517195 Detail

TE28F400B3B110: Features: ` Flexible SmartVoltage Technology- 2.7 V3.6 V Read/Program/Erase- 12 V VPP Fast Production Programming` 2.7 V or 1.65 V I/O Option- Reduces Overall System Power` High Performance- 2.7 V3....

floor Price/Ceiling Price

Part Number:
TE28F400B3B110
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/22

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Product Details

Description



Features:

` Flexible SmartVoltage Technology
- 2.7 V3.6 V Read/Program/Erase
- 12 V VPP Fast Production Programming
` 2.7 V or 1.65 V I/O Option
- Reduces Overall System Power
` High Performance
- 2.7 V3.6 V: 90 ns Max Access Time
- 3.0 V3.6 V: 80 ns Max Access Time
` Optimized Block Sizes
- Eight 8-KB Blocks for Data, Top or Bottom Locations
- Up to Sixty-Three 64-KB Blocks for Code
` Block Locking
- VCC-Level Control through WP#
` Low Power Consumption
- 10 mA Typical Read Current
`Absolute Hardware-Protection
- VPP = GND Option
- VCC Lockout Voltage
` Extended Temperature Operation
- 40 to +85
` Flash Data Integrator Software
- Flash Memory Manager
- System Interrupt Manager
- Supports Parameter Storage, Streaming Data (e.g., Voice)
` Automated Program and Block Erase
- Status Registers
` Extended Cycling Capability
- Minimum 100,000 Block Erase Cycles Guaranteed
` Automatic Power Savings Feature
- Typical ICCS after Bus Inactivity
` Standard Surface Mount Packaging
- 48-Ball BGA* Package
- 48-Lead TSOP Package
- 40-Lead TSOP Package
` Footprint Upgradeable
- Upgrade Path for 4-, 8-, 16-, and 32- Mbit Densities
` ETOX™ VI (0.25 ) Flash Technology



Pinout

  Connection Diagram


Specifications

Extended Operating Temperature
During Read .......................... 40 to +85
During Block Erase
and Program.......................... 40 to +85
Temperature Under Bias ....... 40 to +85
Storage Temperature........... 65 to +125
Voltage on Any Pin
(except VCC, VCCQ and VPP)
with Respect to GND ............. 0.5 V to 3.7 V(1)
VPP Voltage (for Block
Erase and Program)
with Respect to GND ..... 0.5 V to +13.5 V(1,2,4)
VCC and VCCQ Supply Voltage
with Respect to GND ............... 0.2 V to +3.7 V(5)
Output Short Circuit Current.....................100 mA(3)


NOTES:
1. Minimum DC voltage is 0.5 V on input/output pins, with allowable undershoot to 2.0 V for periods < 20 ns. Maximum DC voltage on input/output pins is VCC + 0.5 V, with allowable overshoot to VCC + 1.5 V for periods < 20 ns.
2. Maximum DC voltage on VPP may overshoot to +14.0 V for periods < 20 ns.
3. Output shorted for no more than one second. No more than one output shorted at a time.
4. VPP Program voltage is normally 2.7 V3.6 V.
5. Minimum DC voltage is 0.5 V on VCC and VCCQ, with allowable undershoot to 2.0 V for periods < 20 ns. Maximum DC voltage on VCC and VCCQ pins is VCC + 0.5 V, with allowable overshoot to VCC + 1.5 V for periods < 20 ns.



Description

The Smart 3 Advanced Boot Block, manufactured on Intel's latest 0.25 technology, represents a featurerich olution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40- lead and 48-lead TSOP and 48-ball BGA* packages. Additional information on this product family can be obtained by accessing Intel's WWW page: http://www.intel.com/design/flash.




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