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Package Cooled:SS0P4


Part Number: TLP3240
Package Cooled: SS0P4
Description: The TOSHIBA TLP3240 is a super small-outline photorelay, suitable for surface-mount assembly. The TLP3...
Package Cooled:SS0P4


Package Cooled: SS0P4
Description: The TOSHIBA TLP3240 is a super small-outline photorelay, suitable for surface-mount assembly. The TLP3...
The TOSHIBA TLP3240 is a super small-outline photorelay, suitable for surface-mount assembly. The TLP3240 consists of a GaAℓAs infrared-emitting diode optically coupled to a photo-MOS FET and housed in a 4-pin package. Its characteristics also include low OFF-state current and low output pin capacitance, enabling it to be used in high-frequency measuring instruments.
|
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | |
|
LED |
Forward Current |
IF |
30 |
mA |
| Forward current derating (Ta85) |
IF/Ta |
-0.3 |
mA | |
| Peak transient forward current (Note1) |
IFPT |
5 |
A | |
| Reverse Voltage |
VR |
125 |
V | |
|
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
40 |
V |
| On-State RMS Current |
IT(RMS) |
120 |
mA | |
| On-State Current Derating (Ta25) |
IT/ |
-1.2 |
mA / | |
| Junction Temperature |
Tj |
125 |
||
| Storage Temperature Range |
Tstg |
-40~125 |
||
| Operating Temperature Range |
Topr |
-20to85 |
||
| Lead Soldering Temperature(10s) |
Tsol |
260 |
||
| Isolation voltage (AC,1min.,R.H.60%,Ta=25) Note2 |
BVS |
1500 |
Vrms | |
TLP
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