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TPCP8002

Application• Lead (Pb)-Free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 7 m (typ.)• High forward transfer admittance:|Yfs| = 36 S (typ.)• Low leakage current: IDSS = 10 A (VDS = 20 V)• Enhancement mode: Vth = 0.5 to...

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SeekIC No. : 004526213 Detail

TPCP8002: Application• Lead (Pb)-Free• Small footprint due to small and thin package• Low drain-source ON-resistance: RDS (ON) = 7 m (typ.)• High forward transfer admittance:|Yfs| = 36...

TPCP8002 Data Sheet

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Part Number:
TPCP8002
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/17

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Product Details

Description



Application

• Lead (Pb)-Free
• Small footprint due to small and thin package
• Low drain-source ON-resistance
: RDS (ON) = 7 m (typ.)
• High forward transfer admittance
:|Yfs| = 36 S (typ.)
• Low leakage current
: IDSS = 10 A (VDS = 20 V)
• Enhancement mode
: Vth = 0.5 to 1.2 V (VDS = 10 V, ID = 0.2 mA)


Pinout

Connection Diagram


Specifications

Characteristics
Symbol
Rating
Unit
Drain-source voltage
VDSS
20
V
Drain?gate voltage (RGS = 20 k)
VDGR
20
V
Gate?source voltage
VGSS
±12
V
Drain current DC (Note 1)
ID
9.1
A
Pulse (Note 1)
IDP
36.4
Drain power dissipation (t = 5 s)
(Note 2a)
PD
1.68
W
Drain power dissipation (t = 5 s)
(Note 2b)
PD
0.84
Single pulse avalanche energy
(Note 3)
EAS
21.5
mJ
Avalanche current
IAR
9.1
A
Repetitive avalanche energy (Note 4)
EAR
0.168
mJ
Channel temperature
Tch
150
Storage temperature range
TSTG
-55 ~ 150

Note: For Notes 1 to 5, refer to the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc)




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