TSP1-BF1608H6-L1M2Y Selling Leads, Price trend, TSP1-BF1608H6-L1M2Y DataSheet download, circuit diagram from SeekIC.com

Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color type• RoHS CompliantApplication• Backlighting in dashboard and switch• Telecommun...

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SeekIC No. : 004530577 Detail

TSP1-BF1608H6-L1M2Y: Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color...

TSP1-BF1608H6-L1M2Y Data Sheet

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Part Number:: TSP1-BF1608H6-L1M2Y
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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268 Transactions

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Upload time: 2024/4/27

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Recent History
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Product Details

Description

Features:

• Package in 8mm tape on 7" diameter reel
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder process
• Mono-color type
• RoHS Compliant

Application

• Backlighting in dashboard and switch
• Telecommunication: indicator and backlighting in telephone and fax
• Flat backlight for LCD, switch and symbol
• General use

Specifications

Parameter	Symbol	Rating	Unit
Reverse Voltage	V_R	5	V
Forward Current	I_F	25	mA
Operating Temperature	T_opr	-40~ +85
Storage Temperature	T_stg	-40 ~ +90
Soldering Temperature	T_sol	Reflow soldering: 260 (for 10 seconds)
Soldering Temperature	T_sol	Hand soldering: 350 (for 3 seconds)
Electrostatic Discharge (HBM)	E_SD	150	V
Power Dissipation	P_d	110	mW
Peak Forward Current (Duty 1/10 @1KHz)	I_FP	100	mA

Description

• The TSP1-BF1608H6-L1M2Y SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
• Besides, lightweight makes them ideal for miniature applications. etc.

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