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UNRL113

Features: • Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing.• The PCB mounting area is 1/10 of that of lead type package (3-pin MINI-type package).Specifications Parameter Symbol Rating Unit ...

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SeekIC No. : 004537800 Detail

UNRL113: Features: • Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing.• The PCB mounting area is 1/10 of that of lead...

UNRL113 Data Sheet

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Part Number:
UNRL113
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/10

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Product Details

Description



Features:

• Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing.
• The PCB mounting area is 1/10 of that of lead type package (3-pin MINI-type package).


Specifications

Parameter
Symbol
Rating
Unit
Collector to base voltage
VCBO
-50
V
Collector to emitter voltage
VCEO
-50
V
Collector current
IC
-100
mA
Total power dissipation *
PT
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
−55 to +125
Ta = 25
Note) *: Printed circuit board copper foil for collector portion area: 20.0 mm2 or more, thickness: 1.6 mm


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