UPD5702TU

RF Amplifier RO 551-UPD5702TU-A

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UPD5702TU Picture
SeekIC No. : 00613474 Detail

UPD5702TU: RF Amplifier RO 551-UPD5702TU-A

floor Price/Ceiling Price

Part Number:
UPD5702TU
Mfg:
NEC/CEL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/18

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Product Details

Quick Details

Mounting Style : SMD/SMT Package / Case : TU-8    

Description

Type :
Operating Frequency :
Noise Figure :
Bandwidth :
Output Intercept Point :
Operating Supply Voltage :
Supply Current :
Maximum Operating Temperature :
Packaging :
Mounting Style : SMD/SMT
Package / Case : TU-8


Features:

• MEDIUM OUTPUT POWER:POUT = +21 dBm TYP @PIN = -2 dBm, f = 2.45 GHz
• ON CHIP OUTPUT POWER CONTROL FUNCTION
• SINGLE SUPPLY VOLTAGE:VDS = 3.0 V TYP
• PACKAGED IN 8 PIN L2MM (2.0 X 2.2 X 0.5mm) SUITABLE FOR HIGH- DENSITY SURFACE MOUNT



Application

• 1.9 GHZ Application Ex. PHS etc.
• 2.4 GHz application Ex. Bluetooth, Wireless LAN, etc.
• General purpose medium power AGC amplifier



Specifications

SYMBOLS PARAMETERS UNITS RATINGS
VDS Supply Voltage 1 V 6.0
VGS Supply Voltage 2 V 6.0
PD Power Dissipation2 W 0.866
TA Operating Ambient Temp. -40 to +85
TSTG Storage Temp. Range -65 to +150
PIN(MAX) Maximum Input Level dBm +10
Tj Junction Temperature +150

Notes:
1. Operation in excess of any one of these conditions may result in permanent damage.
2. TA = 25 mounted on 330 x 21 mm epoxy glass PWB.



Description

NEC's UPD5702TU is a silicon LD MOS IC designed for use asa power amplifier up to 2.4 GHz application. This IC consists of two stage amplifiers. The device is packaged in a low cost, surface mount 8 pin L2MM (Leadless Mini Mold) plastic package. Ideally suited for high density surface mount designs.

NEC's stringent quality assurance and test procedures ensure the highest reliability and performance.




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