XQ4000E Selling Leads, Price trend, XQ4000E DataSheet download, circuit diagram from SeekIC.com

Features: • Certified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing)• Also available under the following Standard Microcircuit Drawings (SMD)- XC4005E 5962-97522- XC4010E 5962-97523- XC4013E 5962-97524- XC4025E 5962-97525- XC4028EX 5962-98509• For more informa...

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SeekIC No. : 004549111 Detail

XQ4000E: Features: • Certified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing)• Also available under the following Standard Microcircuit Drawings (SMD)- XC4005E 5962-97522- XC4...

XQ4000E Data Sheet

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Part Number:: XQ4000E
Supply Ability:: 5000

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Product Details

Description

Features:

• Certified to MIL-PRF-38535, appendix A QML
(Qualified Manufacturers Listing)
• Also available under the following Standard Microcircuit Drawings (SMD)
- XC4005E 5962-97522
- XC4010E 5962-97523
- XC4013E 5962-97524
- XC4025E 5962-97525
- XC4028EX 5962-98509
• For more information contact the Defense Supply
Center Columbus (DSCC)
http://www.dscc.dla.mis/v/va/smd/smdsrch.html
• System featured Field-Programmable Gate Arrays
- Select-RAMTM memory: on-chip ultra-fast RAM with
· Synchronous write option
· Dual-port RAM option
- Abundant flip-flops
- Flexible function generators
- Dedicated high-speed carry logic
- Wide edge decoders on each edge
- Hierarchy of interconnect lines
- Internal 3-state bus capability
- Eight global low-skew clock or signal distribution networks
• System Performance beyond 60 MHz
• Flexible Array Architecture
• Low Power Segmented Routing Architecture
• Systems-Oriented Features
- IEEE 1149.1-compatible boundary scan logic support
- Individually programmable output slew rate
- Programmable input pull-up or pull-down resistors
- 12 mA sink current per XQ4000E/EX output
• Configured by Loading Binary File
- Unlimited reprogrammability
• Readback Capability
- Program verification
- Internal node observability
• Backward Compatible with XC4000 Devices
• Development System runs on most common computer platforms
- Interfaces to popular design environments
- Fully automatic mapping, placement and routing
- Interactive design editor for design optimization
• Available Speed Grades:
- XQ4000E -3 for plastic packages only
- -4 for ceramic packages only
- XQ4028EX -4 for all packages

Specifications

Symbol	Description			Units
V_CC	Supply voltage relative to GND		0.5 to +7.0	V
V_IN	Input voltage relative to GND(2)		0.5 to VCC + 0.5	V
V_TS	Voltage applied to High-Z output(2)		0.5 to VCC + 0.5	V
T_STG	Storage temperature (ambient)		65 to +150	°C
T_SOL	Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm)		+260	°C
T_J	Junction temperature	Ceramic package	+150	°C
T_J	Junction temperature	Plastic package	+125	°C

Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Maximum DC excursion above VCC or below Ground must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During
transitions, the device pins may undershoot to 2.0V or overshoot to VCC + 2.0V, provided this over or undershoot lasts less than
10 ns and with the forcing current being limited to 200 mA.

Description

For more information refer to Xilinx XC4000E and XC4000X series Field Programmable Gate Arrays product specification. This data sheet contains pinout tables for XQ4010E only. Refer to Xilinx web site for pinout tables for other devices. (Pinouts for XQ4000E/EX are identical to XC4000E/EX.)

XQ4000E

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