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PDF/DataSheet Download
Datasheet: 2N7372
File Size: 57926 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 2N7373
File Size: 57926 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 2N7000
File Size: 238063 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
These power transistors are produced by PPC's MULTIPLE DIFFUSED PLANAR process. This technology produces high voltage devices with excellent switching speeds, frequency response, gain linearity, saturation voltages, high current gain, and safe operating areas. These devices have excellent unclamped and clamped reverse energy ratings with the base to emitter reversed biased.
Ultrasonically bonded wire leads and gold eutectic die bonding are utilized to permit operating temperature to 200. The hermetically sealed package insures maximum reliability and long life. The isolated low profile package allows for easy PC board fit.
SYMBOL | CHARACTERISTIC | 2N7372 | 2N7373 | UNITS |
VCBO VCEO VEBO |
Collector-Base Voltage Collector-Emitter VoltageEmitter-Base Voltage |
- 100 - 80 - 5.5 |
100 80 5.5 |
V V V |
IC IC IB |
Continuous Collector Current Peak Collector Current Continuous Base Current |
5 10 2 |
5 10 2 |
A A A |
TSTG TJ |
Storage Temperature Operating Junction Temperature Lead Temperature 1/16" from cast for 10 sec. Unclamped Inductive Load Energy |
-65 to 200 -65 to 200 300 15 |
mj | |
PT | Continuous Device Dissipation TC = 25 TC = 100 |
58 33 |
58 33 |
W W |
JC | Thermal Resistance Junction to Case | 3 | 3 | /W |
These power transistors are produced by PPC's MULTIPLE DIFFUSED PLANAR process. This technology produces high voltage devices with excellent switching speeds, frequency response, gain linearity, saturation voltages, high current gain, and safe operating areas. These devices have excellent unclamped and clamped reverse energy ratings with the base to emitter reversed biased.
Ultrasonically bonded wire leads and gold eutectic die bonding are utilized to permit operating temperature to 200. The hermetically sealed package insures maximum reliability and long life. The isolated low profile package allows for easy PC board fit.
SYMBOL | CHARACTERISTIC | 2N7372 | 2N7373 | UNITS |
VCBO VCEO VEBO |
Collector-Base Voltage Collector-Emitter VoltageEmitter-Base Voltage |
- 100 - 80 - 5.5 |
100 80 5.5 |
V V V |
IC IC IB |
Continuous Collector Current Peak Collector Current Continuous Base Current |
5 10 2 |
5 10 2 |
A A A |
TSTG TJ |
Storage Temperature Operating Junction Temperature Lead Temperature 1/16" from cast for 10 sec. Unclamped Inductive Load Energy |
-65 to 200 -65 to 200 300 15 |
mj | |
PT | Continuous Device Dissipation TC = 25 TC = 100 |
58 33 |
58 33 |
W W |
JC | Thermal Resistance Junction to Case | 3 | 3 | /W |