IRL620A, IRL620S, IRL621 Selling Leads, Datasheet
Package Cooled:TO-220 D/C:TO-
IRL620A, IRL620S, IRL621 Datasheet download

Part Number: IRL620A
MFG: --
Package Cooled: TO-220
D/C: TO-
Package Cooled:TO-220 D/C:TO-
IRL620A, IRL620S, IRL621 Datasheet download

MFG: --
Package Cooled: TO-220
D/C: TO-
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PDF/DataSheet Download
Datasheet: IRL620A
File Size: 227336 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRL620S
File Size: 514048 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
200 |
V |
|
ID |
Continuous Drain Current (TC=25°C) |
5 |
A |
| Continuous Drain Current (TC=100°C) |
3.2 | ||
|
IDM |
Drain Current-Pulsed (1) |
18 |
A |
|
VGS |
Gate-to-Source Voltage |
±20 |
V |
|
EAS |
Single Pulsed Avalanche Energy (2) |
33 |
mJ |
|
IAR |
Avalanche Current (1) |
5 |
A |
|
EAR |
Repetitive Avalanche Energy (1) |
3.9 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt (2) |
5 |
V/ns |
|
PD |
Total Power Dissipation (TC=25°C) Linear Derating Factor |
39 0.31 |
W W/°C |
|
TJ , TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +175 |
°C |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds |
300 |
Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low onresistance and cost-effectiveness.
The SMD-220 is a surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface-mount package. The SMD-220 is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface-mount application.
| Parameter | Max. | Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 5.2 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 3.3 | |
| IDM | Pulsed Drain Current | 21 | |
| PD @Tc = 25°C | Power Dissipation | 50 | |
| PD @TC = 25°C | Power Dissipation (PCB Mount)** | 3.1 | W |
| Linear Derating Factor | 0.40 | W/°C | |
| Linear Derating Factor (PCB Mount)** | 0.025 | ||
| VGS | Gate-to-Source Voltage | ±10 | V |
| EAS | Single Pulse Avalanche Energy | 125 | mJ |
| IAR | Avalanche Current | 5.2 | A |
| EAR | Repetitive Avalanche Energy | 5.0 | mJ |
| dv/dt | Peak Diode Recovery dv/dt | 5.0 | V/ns |
| TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 | |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case) |
