IRLR111, IRLR120, IRLR1205 Selling Leads, Datasheet
MFG:IR Package Cooled:TO-252 D/C:09+
IRLR111, IRLR120, IRLR1205 Datasheet download

Part Number: IRLR111
MFG: IR
Package Cooled: TO-252
D/C: 09+
MFG:IR Package Cooled:TO-252 D/C:09+
IRLR111, IRLR120, IRLR1205 Datasheet download

MFG: IR
Package Cooled: TO-252
D/C: 09+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRLR120
File Size: 182933 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRLU/SiHLU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications.
| PARAMETER | SYMBOL | LIMIT | UNIT | ||
| Drain-Source Voltage | VDS | 100 | V | ||
| Gate-Source Voltage | VGS | ± 10 | |||
| Continuous Drain Current | VGS at 5.0 V | TC = 25 | ID | 7.7 | A |
| TC = 100 | 4.9 | ||||
| Pulsed Drain Currenta | IDM | 31 | |||
| Linear Derating Factor | 0.33 | W/ | |||
| Linear Derating Factor (PCB Mount)e | 0.020 | ||||
| Single Pulse Avalanche Energyb | EAS | 210 | mJ | ||
| Repetitive Avalanche Currenta | IAR | 7.7 | A | ||
| Repetitive Avalanche Energya | EAR | 4.2 | mJ | ||
| Maximum Power Dissipation | TC = 25 | PD | 42 | W | |
| Maximum Power Dissipation (PCB Mount)e | TA = 25 | 2.5 | |||
| Peak Diode Recovery dV/dtc | dV/dt | 5.5 | V/ns | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | - 55 to + 150 | |||
| Soldering Recommendations (Peak Temperature) | for 10 s | 260d | |||
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 , L = 5.3 mH, RG = 25 , IAS = 7.7 A (see fig. 12).
c. ISD 9.2 A, dI/dt 110 A/s, VDD VDS, TJ 150.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
