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• International standard packages • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure • Unclamped Inductive Switching (UIS) rated • Low package inductance - easy to drive and to protect • Fast intrinsic Rectifier
IXFH6N100 Typical Application
• DC-DC converters • Synchronous rectification • Battery chargers • Switched-mode and resonant-mode power supplies • DC choppers • AC motor control • Temperature and lighting controls • Low voltage relays
IXFH6N100F Maximum Ratings
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
1000
V
VDGR
TJ = 25°C to 150°C; RGS = 1 M
1000
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
TC = 25°C
6
A
IDM
TC = 25°C, pulse width limited by TJM
24
A
IAR
TC = 25°C
6
A
EAR
TC = 25°C
20
mJ
EAS
TC = 25°C
500
mJ
dv/dt
IS IDM, di/dt 100 A/s, VDD VDSS TJ 150°C, RG = 2
15
V/ns
PD
TC = 25°C
180
W
TJ
-55to+150
°C
TJM
150
°C
Tstg
-55to+150
°C
TL
1.6 mm (0.063 in.) from case for 10 s
300
°C
Md
Mounting torque TO-247
1.13/10 Nm/lb.in.
Weight
TO-247 TO-268
6 4
g g
IXFH6N100F Features
RF capable MOSFETs Double metal process for low gate resistance Rugged polysilicon gate cell structure Unclamped Inductive Switching (UIS) rated Low package inductance - easy to drive and to protect Fast intrinsic rectifier
IXFH6N100F Typical Application
DC-DC converters Switched-mode and resonant-mode power supplies, >500kHz switching DC choppers 13.5 MHz industrial applications Pulse generation Laser drivers RF amplifiers