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NTGS3443T, NTGS3443T1, NTGS3443T1 /443

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Info of NTGS3443T
Info of NTGS3443T1
Info of NTGS3443T1 /443

NTGS3443T, NTGS3443T1, NTGS3443T1 /443 Selling Leads, Datasheet

MFG:ON Semiconductor Category:Discrete Semiconductor Products Package Cooled:2008 D/C:SOT-163

NTGS3443T, NTGS3443T1, NTGS3443T1 /443 Picture

NTGS3443T, NTGS3443T1, NTGS3443T1 /443 Datasheet download

Five Points

Part Number: NTGS3443T

Category: Discrete Semiconductor Products

MFG: ON Semiconductor

Package Cooled: 2008

D/C: SOT-163

Description: MOSFET P-CH 20V 2.2A 6-TSOP

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NTGS3443T1 Parameters

Technical/Catalog Information	NTGS3443T1
Vendor	ON Semiconductor
Category	Discrete Semiconductor Products
Mounting Type	Surface Mount
FET Polarity	P-Channel
Drain to Source Voltage (Vdss)	20V
Current - Continuous Drain (Id) @ 25° C	2.2A
Rds On (Max) @ Id, Vgs	65 mOhm @ 4.4A, 4.5V
Input Capacitance (Ciss) @ Vds	565pF @ 5V
Power - Max	500mW
Packaging	Tape & Reel (TR)
Gate Charge (Qg) @ Vgs	15nC @ 4.5V
Package / Case	6-TSOP
FET Feature	Logic Level Gate
Drawing Number	*
Lead Free Status	Contains Lead
RoHS Status	RoHS Non-Compliant
Other Names	NTGS3443T1 NTGS3443T1 NTGS3443T1OS ND NTGS3443T1OSND NTGS3443T1OS

NTGS3443T1 Maximum Ratings

Rating	Symbol	Value	Unit
Drain−to−Source Voltage	V_DSS	-20	Volts
Gate−to−Source Voltage − Continuous	V_GS	±2	Volts
Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ T_A = 25°C Drain Current − Continuous @ T_A = 25°C − Pulsed Drain Current (T_p < 10 S)	R _JA P _d I _D I_DM	244 0.5 −2.2 −10	°C/W Watts Amps Amps
Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ T_A = 25°C Drain Current − Continuous @ T_A = 25°C − Pulsed Drain Current (T_p < 10 S)	R _JAP _dI _DI _DM	128 1.0 −3.1 −14	°C/W Watts Amps Amps
Thermal Resistance Junction−to−Ambient (Note 3) Total Power Dissipation @ T_A= 25°C Drain Current − Continuous @ T_A = 25°C − Pulsed Drain Current (Tp < 10 S)	R _JAP _dI _D I _DM	62.5 2.0 −4.4 −20	°C/W Watts Amps Amps
Operating and Storage Temperature Range	T_J, T_stg	−55 to 150
Maximum Lead Temperature for Soldering Purposes for 10 Seconds	T_L	260

1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2 in square FR−4 board (1, sq. 2 oz. cu. 0.06, thick single sided), operating to steady state.
3. Mounted onto a 2 in square FR−4 board (1, sq. 2 oz. cu. 0.06, thick single sided), t < 5.0 seconds

NTGS3443T1 Features

• Ultra Low R _DS(on)
• Higher Efficiency Extending Battery Life
• Miniature TSOP6 Surface Mount Package
• Pb−Free Package May be Available. The G−Suffix Denotes a Pb−Free Lead Finish

NTGS3443T1 Typical Application

• Power Management in Portable and Battery−Powered Products, i.e.: Cellular and Cordless Telephones, and CMCIA Cards

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