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Thermal Resistance − Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Continuous Drain Current @ 25°C Continuous Drain Current @ 70°C Pulsed Drain Current (Note 4)
RJA PD ID ID IDM
62.5 2.0 6.5 5.5 50
°C/W W A A A
Thermal Resistance − Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Continuous Drain Current @ 25°C Continuous Drain Current @ 70°C Pulsed Drain Current (Note 4)
RJA PD ID ID IDM
102 1.22 5.07 4.07 40
°C/W W A A A
Thermal Resistance − Junction−to−Ambient (Note 3) Total Power Dissipation @ TA = 25°C Continuous Drain Current @ 25°C Continuous Drain Current @ 70°C Pulsed Drain Current (Note 4)
RJA PD ID ID IDM
172 0.73 3.92 3.14 30
°C/W W A A A
1. Mounted onto a 2, square FR−4 Board (1, sq. 2 oz. Cu 0.06, thick single sided), t < 10 seconds. 2. Mounted onto a 2, square FR−4 Board (1, sq. 2 oz. Cu 0.06, thick single sided), t = steady state. 3. Minimum FR−4 or G−10 PCB, t = steady state. 4. Pulse Test: Pulse Width = 10 s, Duty Cycle = 2%.
NTMD6N02R2 Features
• Ultra Low RDS(on) • Higher Efficiency Extending Battery Life • Logic Level Gate Drive • Miniature Dual SO−8 Surface Mount Package • Diode Exhibits High Speed, Soft Recovery • Avalanche Energy Specified • SO−8 Mounting Information Provided
NTMD6N02R2 Typical Application
• DC−DC Converters • Low Voltage Motor Control • Power Management in Portable and Battery−Powered Products, for example, Computers, Printers, Cellular and Cordless Telephones and PCMCIA Cards