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This Power MOSFET is produced using SemiWell's advanced planar stripe, DMOS technology. This latest technology has been especially designed to minimize on-state resistance, have a low gate charge with superior switching performance, and rugged avalanche characteristics. This Power MOSFET is well suited for synchronous DC-DC Converters and Power Management in portable and battery operated products.
SFP95N03L Maximum Ratings
Symbol
Parameter
Value
Units
VDSS
Drain to Source Voltage
30
V
ID
Continuous Drain Current (TC=25)(Note 6)
95
A
Continuous Drain Current (TC=100)
67.3
A
IDM
Drain Current Pulsed(Note 1)
380
A
VGS
Gate to Source Voltage
±20
V
EAS
Single Pulsed Avalanche Energy (Note 2)
450
mJ
dv/dt
Peak Diode Recovery dv/dt (Note 3)
7.0
V/ns
PD
Total Power Dissipation (@ TC=25)
150
W
Derating Factor above 25 °C
1.0
W/°C
TSTG,TJ
Operating Junction Temperature & Storage Temperature
- 55 ~ 175
°C
TL
Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds.
300
°C
SFP95N03L Features
` Low RDS(on) (0.0085 )@VGS=10V ` Low Gate Charge (Typical 39nC) ` Low Crss (Typical 185pF) ` Improved dv/dt Capability ` 100% Avalanche Tested ` Maximum Junction Temperature Range (175°C)
SFP9610 Maximum Ratings
Symbol
Characteristic
Value
Units
VDSS
Drain-to-Source Voltage
-200
V
ID
Continuous Drain Current (TC=25)
-1.75
A
Continuous Drain Current (TC=100)
-1.0
IDM
Drain Current-Pulsed
-7.0
A
VGS
Gate-to-Source Voltage
±30
V
EAS
Single Pulsed Avalanche Energy
143
mJ
IAR
Avalanche Current
-1.75
A
EAR
Repetitive Avalanche Energy
2.0
mJ
dv/dt
Peak Diode Recovery dv/dt
-5.0
V/ns
PD
Total Power Dissipation (TC=25) Linear Derating Factor
20 0.16
W W/°C
TJ,TSTG
Operating Junction and Storage Temperature Range
- 55 to +150
°C
TL
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds