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STLC2500, STLC2500ATR, STLC2500CTR

STLC2500, STLC2500ATR, STLC2500CTR Selling Leads, Datasheet

MFG:ST  Package Cooled:BGA  D/C:07+

STLC2500, STLC2500ATR, STLC2500CTR Picture

STLC2500, STLC2500ATR, STLC2500CTR Datasheet download

Five Points

Part Number: STLC2500

 

MFG: ST

Package Cooled: BGA

D/C: 07+

 

 

 
 
 
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STLC2500 Suppliers

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  • STLC2500A

  • Vendor: ST D/C: 05+& Qty: 1300  Adddate: 2026-04-25
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  • XENTRON COMPANY LIMITED   China
    Contact: Ms.LiliWan   MSN:xentron1@hotmail.com
    Tel: 86-755-83041490
    Fax: 86-755-83013736
    (0)
  • STL10

  • Vendor: SAMSUNG Pack: BGA D/C: 04+& Qty: 983 Note: IC  Adddate: 2026-04-25
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  • Guangsheng Electronics Co.,Ltd   China
    Contact: Ms.MonicaXu   MSN:xujing_cheesecake@hotmail.com
    Tel: 086-0755-83003554
    Fax: 086-0755-83778418
    (201)
  • STL130

  • Vendor: ST Pack: DIP D/C: 02+& Qty: 1000 Note: 2C006  Adddate: 2026-04-25
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  • Kejin Electronics(HK) Limited   China
    Contact: Ms.JoyLin   MSN:joylin-kejinic@hotmail.com
    Tel: 86-755-83997989
    Fax: 86-755-83282993
    (5)

About STLC2500

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Datasheet: STLC2500

File Size: 247597 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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STLC2500ATR Suppliers

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  • STL10

  • Vendor: SAMSUNG Pack: BGA D/C: 04+& Qty: 983 Note: IC  Adddate: 2026-04-25
  • Inquire Now
  • Guangsheng Electronics Co.,Ltd   China
    Contact: Ms.MonicaXu   MSN:xujing_cheesecake@hotmail.com
    Tel: 086-0755-83003554
    Fax: 086-0755-83778418
    (201)
  • STL130

  • Vendor: ST Pack: DIP D/C: 02+& Qty: 1000 Note: 2C006  Adddate: 2026-04-25
  • Inquire Now
  • Kejin Electronics(HK) Limited   China
    Contact: Ms.JoyLin   MSN:joylin-kejinic@hotmail.com
    Tel: 86-755-83997989
    Fax: 86-755-83282993
    (5)
  • STL20

  • Vendor: SAMSUNG Pack: BGA D/C: 03+& Qty: 1134 Note: IC  Adddate: 2026-04-25
  • Inquire Now
  • Guangsheng Electronics Co.,Ltd   China
    Contact: Ms.MonicaXu   MSN:xujing_cheesecake@hotmail.com
    Tel: 086-0755-83003554
    Fax: 086-0755-83778418
    (201)

About STL100NH3LL

PDF/DataSheet Download

Datasheet: STL100NH3LL

File Size: 493880 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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STLC2500CTR Suppliers

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  • STL10

  • Vendor: SAMSUNG Pack: BGA D/C: 04+& Qty: 983 Note: IC  Adddate: 2026-04-25
  • Inquire Now
  • Guangsheng Electronics Co.,Ltd   China
    Contact: Ms.MonicaXu   MSN:xujing_cheesecake@hotmail.com
    Tel: 086-0755-83003554
    Fax: 086-0755-83778418
    (201)
  • STL130

  • Vendor: ST Pack: DIP D/C: 02+& Qty: 1000 Note: 2C006  Adddate: 2026-04-25
  • Inquire Now
  • Kejin Electronics(HK) Limited   China
    Contact: Ms.JoyLin   MSN:joylin-kejinic@hotmail.com
    Tel: 86-755-83997989
    Fax: 86-755-83282993
    (5)
  • STL20

  • Vendor: SAMSUNG Pack: BGA D/C: 03+& Qty: 1134 Note: IC  Adddate: 2026-04-25
  • Inquire Now
  • Guangsheng Electronics Co.,Ltd   China
    Contact: Ms.MonicaXu   MSN:xujing_cheesecake@hotmail.com
    Tel: 086-0755-83003554
    Fax: 086-0755-83778418
    (201)

About STL100NH3LL

PDF/DataSheet Download

Datasheet: STL100NH3LL

File Size: 493880 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Download : Click here to Download

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STLC2500 General Description

The STLC2500 is a single chip ROM-based Bluetooth solution implemented in 0.13 m ultra low power, low leakage CMOS technology for applications requiring integration up to HCI level. Patch RAM is available enabling multiple patches/upgrades.

The STLC2500's main interfaces are UART for HCI transport, PCM for voice and GPIOs for control purposes. The Radio is designed for the single chip requirement and for drastic power consumption reduction.

STLC2500 Maximum Ratings

Symbol Parameter Min. Max. Unit
VDD_HV Regulator input supply voltage Vss - 0.3 4.0 V
VDD_IO_x Supply voltage I/O Vss - 0.3 4.0 V
Vssdiff Maximum voltage difference between different types of VSS pins -0.3 0.3 V
Vin Input voltage of any digital pin Vss - 0.3 4.0 V
Tstg Storage temperature -65 +150
Tlead Lead temperature <10s   +250

STLC2500 Features

Bluetooth™ specification compliance: V1.1 and V1.2
Ericsson Licensing Technology Baseband Core (EBC)
Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability
Asynchronous Connection Oriented (ACL) logical transport link
Synchronous Connection Oriented (SCO) link:2 simultaneous SCO channels
Support Pitch-Period Error Concealment (PPEC)
Improves speech quality in the vicinity of interference
Improves coexistence with WLAN
Works at receiver, no Bluetooth implication
Adaptive Frequency Hopping (AFH): hopping kernel, channel assessment as Master and as Slave
Faster Connection: Interlaced scan for Page and Inquiry scan, first FHS without random back off, RSSI used to limit range
Extended SCO (eSCO) links
HW support for packet types
ACL: DM1, 3, 5 and DH1, 3, 5
SCO: HV1, 3 and DV
eSCO: EV3, 5
Clock support
System clock input (digital or sine wave) at 13, 26, 19.2 or 38.4 MHz
LPO clock input at 3.2, 16.384, 32 or 32.768 kHz
ARM7TDMI CPU
32-bit Core
AMBA (AHB-APB) bus configuration
Patch RAM capability
Memory organization
On chip RAM, including provision for patches
On chip ROM, preloaded with SW up to HCI
Communication interfaces
Fast UART
PCM interface
4 programmable GPIOs
External interrupts possible through the GPIOs
Fast master I2C interface
Efficient support for WLAN coexistence in collocated scenario
Ciphering support up to 128 bits key
Software support
Lower level stack (up to HCI)
HCI Transport Layer: H4 (including proprietary extensions)
HCI proprietary commands (e.g. peripherals control)
Single HCI command for patch/upgrade download
Single power supply with internal regulators for core voltage generation
Supports 1.65 to 2.85 Volts IO systems
Total number of external components limited to 7 (6 decoupling capacitors and 1 filter) thanks to:
Fully integrated synthesizer (VCO and loop filter)
Integrated antenna switch
Low IF receiver
Auto calibration (VCO, Filters)
No need for calibration of the RF part
Timer and watchdog
Power class 2 compatible
Ultra low power architecture with 3 different low power levels:
Sleep Mode
Deep Sleep Mode
Complete Power Down Mode
Software Initiated Low Power Mode
Dual Wake-up mechanism: initiated either by the Host or by the Bluetooth device
Standard TFBGA-84 pins package

STLC2500 Connection Diagram

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