Intel＇s Newest Microprocessor Technology: Ivy Bridge

Published:2011/5/5 21:18:00 Author:Phyllis From:SeekIC

Recently, Intel has uncovered its new generation microprocessor technology code named Ivy Bridge. The following chips will use a 22nm manufacture process that packs more transistors compared with the current 32nm system due to the usage of new low energy consumption Tri-Gate 3D transistors. Intel’s competitors like AMD, IBM and other chip manufacturers are understood to undertake similar designs.

For the commercial processor industry, making more transistors built onto silicon chips become possible is of vital importance. And this announcement means a lot. One of the main progresses is that the length of the transistor gate is measured in nanometers, and 1nm is equal to 1 billionth of a meter. The width of a human hair is about 60.000nm. The existing most advanced microchip technology features a 32nm gate.

The technology of 22nm would play a crucial role in the evolution of microprocessor has been well known for a long time. But when will Intel start to put this technology into practical is still unknown. Intel said it expects to begin commercial production at the end of the year. The arrival of 3D transistors will surely spray a huge splash as this means the time of better performance for the same battery life or longer battery life for the same performance is going to come.

In the present microprocessor design, the conducting channel passes through a switching gate is planar or flat on the silicon wafer. However, the Tri-Gate system adopts 3D fins instead of the old ones to achieve more conductivity and high efficiency. This new process will ensure Intel’s dominant position in the market.

The innovation in 3D architecture would not only benefit the desktop processors, but also the portable devices. With this technology, Intel may even be able to compete with ARM in the mobile industries. The Ivy Bridge design allows the number of transistors twice as much as that on 32nm chips.

The next chip manufacturing process are expected to be 14nm, followed by 11nm. The related integrated circuit is MB3752.

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