Published:2011/9/25 22:32:00 Author:Phyllis
As a leading manufacturer of test & measurement, communications and broadcasting equipment, Rhode & Schwarz has rolled out a training and certification program for the wireless communication infrastructure community. The Rohde Scholar Training Program consists of several two-day courses that address mobile communications, television and... (View)
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Published:2011/9/25 21:49:00 Author:Phyllis
MultiPhy, Ltd, a major player in DSP-based high bandwidth CMOS communications semiconductors, launched the MP1100Q, a 100Gb/s DEMUX receiver chip recently to meet the low-cost and low-power needs of the quickly growing 100G metro transport marketplace. The MP1100Q is a quad 25Gb/s to 28Gb/s CMOS demux receiver. It employs advance... (View)
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Published:2011/9/23 7:32:00 Author:Amy
Texas Instruments has released the first new integrated three-phase brushless motor pre-drivers. The DRV8301 reduces board space as much as 60 percent as compared to the next closest integrated solution. In addition, the device drives sub-10-A to 60-A external FETs, and offers current scalability, desirable thermal performance and effic... (View)
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Published:2011/9/23 7:13:00 Author:Amy
Maxon motor’s 70-W flat brushless motor delivers a max and continuous torque of 130 mNm at an efficiency of up to 85 percent. The new motor in its 45 mm diameter is available with Hall sensors and comes in four windings (24, 30, 36, 48 V). It can be connected with more than 54 different planetary and spur gearheads. For the purposes of motion control, the company offers a wide range of servo controllers and posi... (View)
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Published:2011/9/23 3:17:00 Author:Amy
Diodes, a leading global manufacturer and supplier of high-quality application specific standard products, has introduced the industry’s smallest fully featured single-chip fan driver with high-output drive capability to provide a cost-effective solution for fan and motor drive applications. These devices are developed for driving low-power single-phase brushless DC (BLDC) fans and motors. The AH5795 can offer a... (View)
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Published:2011/9/23 3:12:00 Author:Li xiao na
An ARM Cortex M4 core has been put by STMicroelectronics on its 32-bit microcontroller range. The M4 is used to bring signal–processing to the ST32 controller range. Mass production of the controller has begun now. The single-cycle DSP instructions of the STM32 F4 enter the digital signal controller market. The computational capability and DSP instructions for applications, such as high-end motor control me... (View)
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Published:2011/9/23 2:53:00 Author:Phyllis
A differential probe for applications that require high sensitivity, wide dynamic range and minimal load on the DUT’s operating point has been developed by Rohde & Schwarz. High-speed interfaces are used in wireless communications and the electronics industry, in aerospace and defense, and also in medical engineering and differential probes are used to analyze the ground-referenced or differential signals used ... (View)
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Published:2011/9/23 1:58:00 Author:Li xiao na
A complete ZigBee Pro is taken by the AND Technology Research (AND TR) and Renesas, which aims for the smart metering, building automation and home appliance applications. With Renesas’ M16C/6B single chip ZigBee silicon, the AND TR design kits can be tuned to offer optimum RF performance in the most demanding situations and have been tested for interoperability at ZigBee Smart Energy interoperability event... (View)
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Published:2011/9/23 1:55:00 Author:Phyllis
Phase-change memory (PCM) technology is regarded as a good candidate for use as programmable artificial synapses in neuromorphic circuitry because of its great energy efficiency, scaling potential, endurance and reliability. Some research papers at the upcoming IEDM will report how PCM technology enables biologically inspire... (View)
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Published:2011/9/23 1:41:00 Author:Amy
Recently, E-Switch has released the KJD17 Series pushbutton switch, offering an industrial design and a PVC cap for dust and water protection, equivalent to an IP54 rating. The pushbutton switch has a built-in electromagnet providing automatic safety protection from power outages and restarts. It is rated at 2 hp and 16 A, and is UL list... (View)
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Published:2011/9/23 1:25:00 Author:Phyllis
Over the next five years, mergers and acquisitions will be common as the larger player fill in the gaps of their integrated solution for OEMs who must fuse the outputs of multiple MEMS sensors for a wider variety of applications than just tablets and phones. STMicroelectronics NV, described as the leading supplier of MEMS for con... (View)
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Published:2011/9/22 23:01:00 Author:Li xiao na
A family of LLC power supply ICs is introduced by Power Integrations. The controller, high- and low-side drivers, and both mosfets are included in this family, but not power factor correction. The HiperLCS is an integrated LLC power stage incorporating a multi-function controller, high-side and low-side gate drivers, plus two power M... (View)
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Published:2011/9/22 21:50:00 Author:Li xiao na
A programme named JurASIC parts has been taken by analogue design specialists JVD, which aims to bring obsolete and NLA analogue ICs back into production for older commercial and military applications. In order to better manage theirt business, semiconductor companies, especially the companies with dozen or more years of history, should change their product. The cost to maintain a low or near zero volume pr... (View)
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Published:2011/9/22 5:56:00 Author:Amy
With low quiescent current and alarm temperature detection function, Torex Semiconductor has expanded an ultra-small (1.2 x 0.9 x 0.4mm) analog temperature sensor XC3101 series. Using the ultra-small USPN-4 package (1.2 x 0.9 x h0.4mm), the XC3101 series of analog temperature sensors achieve low quiescent currents and include an alarm temp... (View)
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Published:2011/9/22 3:53:00 Author:Amy
3DM-GX3® -45, the latest line of innovative inertial sensors from MicroStrain, is a GPS-aided inertial navigation system (GPS/INS). The on-board Kalman filter provides optimal position, velocity, and attitude (PVA) estimates. With high performance tracking capabilities comparable to higher cost units, the 3DM-GX3® -45 is i... (View)
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Published:2011/9/22 3:39:00 Author:Li xiao na
According to the predication of HIS iSuppli, the semiconductor market will grow by 2.9%. This data is better than the previous forecast of Gartner. The continuing impact of a weakened and stagnant economy is expected to continue to drag on the semiconductor market in 2012, limiting revenue growth to 3.4%. The growing economic weakn... (View)
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Published:2011/9/22 2:52:00 Author:Phyllis
The time for making critical decisions for how to make 14nm chips to hit production in 2015 is limit, and capital equipment vendors are falling behind, according to Taiwan Semiconductor Manufacturing Co. To make 14-nm chips cost effectively, TSMC believes it needs to move to next-generation lithography and 450-mm wafers, but capita... (View)
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Published:2011/9/22 1:46:00 Author:Li xiao na
The speedy deployment of smart meter technologies needs to be inspired by the tough carbon reduction goals in the European Union. Pike Research’s report, Smart Grids in Europe, examines smart grid trends in Europe and forecasts the size and growth of the market for smart grid technologies through 2020. According to this research, the entire investment in smart grid technologies within the region will re... (View)
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Published:2011/9/22 1:45:00 Author:Phyllis
On September 21st, market research firm IHS iSuppli cut its forecast for 2011 semiconductor market growth for the second time in two months due to the impact of increasing economic woes and consumer pessimism. According to IHS, it now expects semiconductor revenue to grow 2.9 percent this year with $313.3 billion, 1.7 percent down tha... (View)
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Published:2011/9/21 23:02:00 Author:Li xiao na
Semiconductor design begins to use the 3D IC package. This can reduce the package size and power consumption while increasing performance due to the improved physical characteristics of the very small TSV connections compared to the much larger bond wires used in traditional packaging. However, the test process will become more compl... (View)
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