Application4-V gate driveLow drain−source ON resistance : RDS (ON) = 80 m (typ.)High forward transfer admittance : |Yfs| = 8.0 S (typ.) Low leakage current : IDSS = −100 A (max) (VDS = −60 V) Enhancement mode : Vth = −0.8~−2.0 V (VDS = −10 V, ID = −1 mA)Sp...
2SJ312: Application4-V gate driveLow drain−source ON resistance : RDS (ON) = 80 m (typ.)High forward transfer admittance : |Yfs| = 8.0 S (typ.) Low leakage current : IDSS = −100 A (max) (VDS = &...
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| Characteristics |
Symbol |
Rating |
Unit | |
| Drain-source voltage |
VDSS |
−60 |
V | |
| Drain−gate voltage (RGS = 20 k) |
VGSS |
−60 |
V | |
| Gate−source voltage |
VG2S |
±20 |
V | |
| Drain current | DC (Note 1) |
ID |
−14 |
A |
| Pulse (Note 1) |
IDP |
−56 | ||
| Drain power dissipation (Tc = 25) |
PD |
40 |
W | |
| Channel temperature |
Tch |
150 |
||
| Storage temperature range |
TSTG |
-55 ~ +150 |
||
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).