Application` Low drain−source ON-resistance : RDS (ON) = 1.6 (typ.)` High forward transfer admittance : |Yfs| = 5.0 S (typ.)` Low leakage current : IDSS = 100 A (max) (VDS = 720 V)` Enhancement mode : Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)Specificati...
2SK4014: Application` Low drain−source ON-resistance : RDS (ON) = 1.6 (typ.)` High forward transfer admittance : |Yfs| = 5.0 S (typ.)` Low leakage current : IDSS = 100 A ...
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| Symbol | Characteristic | Rating | Unit | |
| VDSS | Drain-Source Voltage | 900 | V | |
| VDGR | Drain−gate voltage (RGS = 20 k) | 900 | V | |
| VGSS | Gate−source voltage | ±30 |
V | |
| ID IDP |
Drain current | DC (Note 1) | 6 | A |
| Pulse (Note 1) | 18 | |||
| PD | Drain power dissipation (Tc=25) | 45 | W | |
| EAS | Single-pulse avalanche energy (Note 2) |
972 | mJ | |
| IAR | Avalanche current | 6 | A | |
| EAR | Repetitive avalanche energy (Note 3) | 15 | mJ | |
| Tch | Channel temperature | 150 | ||
| Tstg | Storage temperature range | −55~150 | ||
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling recautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).