ABLEBOND® 2815A

Features: • Excellent thermal and electrical conductivity• Good dispensability and good fillet formation• Good performance on Ag/Cu leadframes• Low moisture absorptionDescriptionABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal res...

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ABLEBOND® 2815A Picture
SeekIC No. : 004264199 Detail

ABLEBOND® 2815A: Features: • Excellent thermal and electrical conductivity• Good dispensability and good fillet formation• Good performance on Ag/Cu leadframes• Low moisture absorptionDescrip...

floor Price/Ceiling Price

Part Number:
ABLEBOND® 2815A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/4/30

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Product Details

Description



Features:

• Excellent thermal and electrical conductivity
• Good dispensability and good fillet formation
• Good performance on Ag/Cu leadframes
• Low moisture absorption



Description

ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.




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