AD7945

(TA = +25unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . ..........................0.3 V to +6 V
IOUT1 to DGND . . . . . . . . . . . . . . . . . . ........................ 0.3 V to VDD + 0.3 V
IOUT2 to DGND . . . . . . . . . . . . . . . . . . . .......................0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . ............................0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . ............................ 0.3 V to VDD + 0.3 V
VRFB, VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . ............................ ±15 V
Input Current to Any Pin Except Supplies2 . . . . . . . ........................... ±10 mA
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . .................................. 40to +85
Extended (T Version) . . . . . . . . . . . . . . .................................. 55to +125
Storage Temperature Range . . . . . . . . . . . ............................. 65to +150
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . ...........................+150
DIP Package, Power Dissipation . . . . . . . . . . . . . . . ............................. 670 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . ................................ 116/W
Lead Temperature, Soldering, (10 sec) . . . . . . . . . ................................. +260
SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . ...........................450 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .................................. 75/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . ...................................... +215
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . ...................................... +220
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . .............................875 mW
qJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .................................... 132/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . ........................................ +215
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . ........................................ +220

NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up.