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Part Number: AD8608ARZ
Description: The AD8608ARZ is one member of the AD8608 series.The AD8608 is single, dual, and quad rail-to-rail inp...


Description: The AD8608ARZ is one member of the AD8608 series.The AD8608 is single, dual, and quad rail-to-rail inp...
The AD8608ARZ is one member of the AD8608 series.The AD8608 is single, dual, and quad rail-to-rail input and output, single-supply amplifiers.They feature very low offset voltage, low input voltage and current noise, and wide signal bandwidth. They use the Analog Devices, Inc. patented DigiTrim® trimming technique, which achieves superior precision without laser trimming.
Features of the AD8608ARZ are:(1)low offset voltage: 65 V maximum; (2)low input bias currents: 1 pA maximum; (3)low noise: 8 nV/Hz; (4)wide bandwidth: 10 MHZ; (5)high open-loop gain: 1000 V/mV; (6)Unity gain stable; (7)single-supply operation: 2.7 V to 5.5 V.The combination of low offsets, low noise, very low input bias currents, and high speed makes these amplifiers useful in a wide variety of applications. Filters, integrators, photodiode amplifiers, and high impedance sensors all benefit from the combination of performance features.
The absolute maximum ratings of the AD8608ARZ can be summarized as:(1)storage temperature range:-65 to 150;(2)junction temperature range all packages:-65 to 150;(3)supply voltage:6V;(4)differential input voltage:6V.Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Efforts have been made at a product level to reduce the effect of ambient light; the under bump metal (UBM) has been designed to shield the sensitive circuit areas on the active side (bump side) of the die. However, if an application encounters any light sensitivity with the AD8605ACB, shielding the bump side of the WLCSP package with opaque material should eliminate this effect. Shielding can be accomplished using materials such as silica-filled liquid epoxies that are used in flip-chip underfill techniques.
AD800
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