ADG623

Features: 5.5 (Max) On Resistance 0.9 (Max) On-Resistance Flatness 2.7 V to 5.5 V Single Supply ±2.7 V to ±5.5 V Dual Supply Rail-to-Rail Operation 10-Lead SOIC Package Typical Power Consumption (<0.01 W) TTL/CMOS Compatible InputsApplicationAutomatic Test EquipmentPower RoutingCommunication...

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ADG623 Picture
SeekIC No. : 004275099 Detail

ADG623: Features: 5.5 (Max) On Resistance 0.9 (Max) On-Resistance Flatness 2.7 V to 5.5 V Single Supply ±2.7 V to ±5.5 V Dual Supply Rail-to-Rail Operation 10-Lead SOIC Package Typical Power Consumption ...

floor Price/Ceiling Price

Part Number:
ADG623
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

5.5 (Max) On Resistance
0.9 (Max) On-Resistance Flatness
2.7 V to 5.5 V Single Supply
±2.7 V to ±5.5 V Dual Supply
Rail-to-Rail Operation
10-Lead SOIC Package
Typical Power Consumption (<0.01 W)
TTL/CMOS Compatible Inputs





Application

Automatic Test Equipment
Power Routing
Communication Systems
Data Acquisition Systems
Sample and Hold Systems
Avionics
Relay Replacement
Battery-Powered Systems





Pinout

  Connection Diagram

ADG623 Diagram




Specifications

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . ... . 0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 6.5 V
Analog Inputs2 . . . . . . . . . . . . . . .VSS 0.3 V to VDD + 0.3 V
Digital Inputs2 . . . . . . . . . . .. . . . . . . 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 50 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . .40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
µSOIC Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering (10 seconds) . . .. . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C


Switch Type SPST
# Channels 2
Ron (Ohms) 4Ohms
Id, Is (ON) 10pA
Bandwidth 230MHz
t ON 75ns
t OFF 45ns
Supply Voltage Dual (±5V),Single (+5V)





Description

The ADG621/ADG622/ADG623 are monolithic, CMOS SPST (single-pole, single-throw) switches. Each switch  conducts equally well in both directions when on.

The ADG621/ADG622/ADG623 contain two independent switches. The ADG621 and ADG622 differ only in that both switches are normally open and normally closed respectively. In the product, Switch 1 is normally open and Switch 2 is normally closed. The product exhibits break-before-make switching action.

The ADG621/ADG622/ADG623 offers low on-resistance of 4 Ω, which is matched to within 0.25 Ω between channels. These switches also provide low power dissipation yet gives high switching speeds. The ADG621/ADG622/ADG623 are available in a 10-lead µSOIC package.






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