Features: Low On Resistance 0.8 Max at 125C
0.25 Max On Resistance Flatness
1.8 V to 5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: 40 to +125
Rail-to-Rail Operation
6-Lead SOT-23 Package, 8-Lead SOIC Package, and
6-Bump MicroCSP (Micro Chip Scale Package) ADG819
Fast Switching Times
Typical Power Consumption (<0.01 W)
TTL-/CMOS-Compatible Inputs
Pin Compatible with the ADG719 (ADG819ApplicationPower Routing
Battery-Powered Systems
Communication Systems
Data Acquisition Systems
Cellular Phones
Modems
PCMCIA Cards
Hard Drives
Relay ReplacementPinout
SpecificationsVDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Analog Inputs2 . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . .. . . . . . . . 0.3 V to VDD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to +85°C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SOIC Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package (4-Layer Board)
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . . 119°C/W
MicroCSP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . . . . 235°C
DescriptionThe ADG819 and the ADG820 are monolithic, CMOS, SPDT (single-pole, double-throw) switches. These switches are designed on a submicron process that provides low power dissipation yet gives high switching speed, low On resistance, and low leakage currents.
Low power consumption and an operating supply range of 1.8 V to 5.5 V make the ADG819 and ADG820 ideal for battery-powered,portable instruments.
Each switch of the ADG819 and the ADG820 conducts equally well in both directions when on. The ADG819 exhibits breakbefore- make switching action, thus preventing momentary shorting when switching channels. The product exhibits make-beforebreak action.
The ADG819 and the ADG820 are available in a 6-lead SOT-23 package and an 8-lead SOIC package. The ADG819 is also available in a 2 * 3 bump 1.14 mm * 2.18 mm MicroCSP package. This chip occupies only a 1.14 mm * 2.18 mm area, making it the ideal candidate for space-constrained applications
ADG820 Data Sheet
