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AM0608-020

Features: · Refractory/Gold Metallization· Internal Input Matching· Metal/Ceramic Hermetic Package· POUT = 20 W Min.· GP = 9.0 dB GainApplication· Avionics ApplicationsSpecifications Symbol Parameter Value Unit PDISS Power Dissipation* (TC 100°C) 100 W IC Device ...

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AM0608-020: Features: · Refractory/Gold Metallization· Internal Input Matching· Metal/Ceramic Hermetic Package· POUT = 20 W Min.· GP = 9.0 dB GainApplication· Avionics ApplicationsSpecifications Symbol ...

AM0608-020 Data Sheet

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Part Number:
AM0608-020
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/18

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Product Details

Description



Features:

· Refractory/Gold Metallization
· Internal Input Matching
· Metal/Ceramic Hermetic Package
· POUT = 20 W Min.
· GP = 9.0 dB Gain


Application

· Avionics Applications


Specifications

Symbol
Parameter
Value
Unit
PDISS
 Power Dissipation* (TC 100°C)
100
W
IC
 Device Current*
2.4
A
VCC
 Collector-Supply Voltage*
40
V
TJ
 Junction Temperature (Pulsed RF Operation)
250
°C
TSTG
 Storage Temperature
-65 to +150
°C



Description

The AM0608-020 is an internally-matched, common base silicon bipolar device optimized for pulsed applications in the 600 750 MHz frequency range. Housed in the popular IMPACTM hermetic metal/ceramic package,this device uses a refractory/gold overlay die geometry for ruggedness and long-term reliability.




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