HEATSINK CPU W/ADHESIVE 1.21"SQ
BDN12-5CB/A01: HEATSINK CPU W/ADHESIVE 1.21"SQ
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| Capacitance : | 16.5 pF | Series: | BDN |
| Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.21" (30.73mm) |
| Width: | 1.210" (30.73mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.555" (14.10mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 5.2°C/W @ 400 LFM | Thermal Resistance @ Natural: | 16.5°C/W |
| Material: | Aluminum |
| Technical/Catalog Information | BDN12-5CB/A01 |
| Vendor | CTS Thermal Management Products |
| Category | Fans, Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.550" (14.00mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 5.2°C/W @ 400 LFM |
| Outline | 30.73mm x 30.73mm |
| Thermal Resistance @ Natural | 16.5°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | BDN12 5CB A01 BDN125CBA01 294 1110 ND 2941110ND 294-1110 |