DO-214AC surface mountable package of BZG03 with glass passivated chip. The well-defined void-free case of BZG03is of a transfer-moulded thermo-setting plastic.
DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package of BZG01has two J bent leads.