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MFG:VISHAY  Package Cooled:DO-214AA  D/C:2009+  

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Part Number: BZG04-11

 

MFG: VISHAY

Package Cooled: DO-214AA

D/C: 2009+

Description: DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case is of a transfer-...


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BZG04-11 General Description


DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

BZG04-11 Maximum Ratings

SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
PRSM
 non-repetitive peak reverse power dissipation 10/1000 ms exponential pulse (see Fig.4); Tj = 25 °C prior to surge;see also Fig.2
-
300
W
Tstg
 storage temperature  
-65
+175
°C
Tj
 junction temperature  
-65
+175
°C

BZG04-11 Features

· Glass passivated
· High maximum operating temperature
· Low leakage current
· Excellent stability
· UL 94V-O classified plastic package
· Transient suppressor stand-off voltage range:8.2 to 220 V for 32 types
· Shipped in 12 mm embossed tape.

BZG04-11 Typical Application

Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

BZG04-11 datasheet

BZG04-11
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