CY62127V

Features: • 2.7V3.6V operation• CMOS for optimum speed/power• Low active power (70 ns)-198 mW (max.) (55 mA)• Low standby power (70 ns, LL version)-54 W (max.) (15 A)• Automatic power-down when deselected-Power down either withCE or BHE andBLE HIGH• Independent ...

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CY62127V Picture
SeekIC No. : 004319384 Detail

CY62127V: Features: • 2.7V3.6V operation• CMOS for optimum speed/power• Low active power (70 ns)-198 mW (max.) (55 mA)• Low standby power (70 ns, LL version)-54 W (max.) (15 A)• ...

floor Price/Ceiling Price

Part Number:
CY62127V
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

• 2.7V3.6V operation
• CMOS for optimum speed/power
• Low active power (70 ns)
-198 mW (max.) (55 mA)
• Low standby power (70 ns, LL version)
-54 W (max.) (15 A)
• Automatic power-down when deselected
-Power down either with CE or BHE and BLE HIGH
• Independent control of Upper and Lower Bytes
• Available in 44-pin TSOP II (forward)



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines,
not tested.)
Storage Temperature ................................. 65 to +150
Ambient Temperature with
Power Applied............................................. 55 to +125
Supply Voltage on VCC to Relative GND[1] ....0.5V to +4.6V
DC Voltage Applied to Outputs
in High Z State[1] ..................................0.5V to VCC + 0.5V
DC Input Voltage[1]...............................0.5V to VCC + 0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA



Description

The CY62127V is a high-performance CMOS Static RAM organized as 65,536 words by 16 bits. This device has an automatic power-down feature that significantly reduces power consumption by 99% when deselected. The device enters power-down mode when CE is HIGH or when CE is LOW and both BLE andBHE are HIGH.

Writing to the CY62127V is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O9 through I/O16) is written into the location specified on the address pins (A0 through A15).

Reading from the CY62127V is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O9 to I/O16. See the truth table at the back of this datasheet for a complete description of read and write modes.

The input/output pins (I/O1 through I/O16) CY62127V are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHEBLE HIGH), or during a write operation (CELOW, and WE LOW).

The CY62127V is available in standard 44-pin TSOP Type II (forward pinout) and mini-BGA packages.




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