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Part Number: CY7C1340F

 

 

 

 

Description: The CY7C1340F SRAM integrates 131,072 x 32 SRAM cellswith advanced synchronous peripheral circuitry an...


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CY7C1340F General Description


The CY7C1340F SRAM integrates 131,072 x 32 SRAM cellswith advanced synchronous peripheral circuitry and a two-bitcounter for internal burst operation. All synchronous inputs aregated by registers controlled by a positive-edge-triggeredClock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable(CE1), depth-expansion Chip Enables (CE2 and CE3), BurstControl inputs (ADSC, ADSP, andADV), Write Enables(BW[A:D], and BWE), and Global Write (GW). Asynchronousinputs include the Output Enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge ofclock when either Address Strobe Processor (ADSP) orAddress Strobe Controller (ADSC
) are active. Subsequentburst addresses can be internally generated as controlled bythe Advance pin (ADV).

Address, data inputs, and write controls are registered on-chipto initiate a self-timed Write cycle.This part supports Byte Writeoperations (see Pin Descriptions and Truth Table for furtherdetails). Write cycles can be one to four bytes wide ascontrolled by the byte write control inputs. GWactive
LOWcauses all bytes to be written. This device incorporates anadditional pipelined enable register which delays turning off
the output buffers an additional cycle when a deselect isexecuted.This feature allows depth expansion without penal-izing system performance.

The CY7C1340F operates from a +3.3V core power supplywhile all outputs operate with a +3.3V or a +2.5V supply. Allinputsand outputs are JEDEC-standard JESD8-5-compatible..

CY7C1340F Maximum Ratings

(Above which the useful life may be impaired. For user guide-lines, not tested.)
Storage Temperature.................................................................65°C to +150°
Ambient Temperature with
Power Applied..........................................................................55°C to +125°C
Supply Voltage on VDD Relative to GND.......................................0.5V to +4.6V
DC Voltage Applied to Outputs
in Three-State...................................................................0.5V to VDDQ + 0.5V
DC Input Voltage.................................................................0.5V to VDD + 0.5V
Current into Outputs (LOW)......................................................................20 mA
Static Discharge Voltage.........................................................................>2001V
(per MIL-STD-883,Method 3015)
Latch -up Current..................................................................................>200 mA

CY7C1340F Features

•Registered inputs and outputs for pipelined operation
•Optimal for performance (Double-Cycle deselect)
   -Depth expansion without wait state
•128K * 32-bit common I/O architecture
•3.3V 5% and +10% core power supply (VDD)
•3.3V / 2.5V I/O supply (VDDQ)
•Fast clock-to-output times
  -2.6 ns (for 250-MHz device)
  -2.6 ns (for 225-MHz device)
  -2.8 ns (for 200-MHz device)
  -3.5 ns (for 166-MHz device)
  -4.0 ns (for 133-MHz device)
  -4.5 ns (for 100-MHz device)
•Provide high-performance 3-1-1-1 access rate
•User-selectable burst counter supporting Intel
Pentium interleaved or linear burst sequences
•Separate processor and controller address strobes
•Synchronous self-timed writes
•Asynchronous Output Enable
•JEDEC-standard 100-pin TQFP package and pinout
•"ZZ" Sleep Mode option    
         

CY7C1340F Connection Diagram

CY7C1340F  Connection Diagram

CY7C1340F datasheet

CY7C1340F
PDF/DataSheet Download

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