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MFG:500  Package Cooled:IXYS  

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DSE Series Datasheet download

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Part Number: DSEP30-06CR

 

MFG: 500

Package Cooled: IXYS

 

 

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DSEP30-06CR Maximum Ratings

Symbol Test Conditions Maximum Ratings
IFRMS   70 A
IFAVM TC = 135°C; rectangular, d = 0.5 30 A
IFRM tP < 10 µs; rep. rating, pulse width limited by TVJM tbd A
IFSM TVJ = 45°C; tp = 10 ms (50 Hz), sine 300 A
EAS
TVJ = 25°C; non-repetitive
IAS = 3 A; L = 180 µH

1.2

mJ
IAR VA = 1.5`VR typ.; f = 10 kHz; repetitive 0.3 A
TVJ   -55...+175 °C
TVJM   175 °C
Tstg   -55...+150 °C
Ptot TC = 25°C 250 W
VISOL 50/60 Hz RMS; IISOL 1 mA 2500 V~
FC
mounting force with clip
20...120 N
Weight typical
6
g

DSEP30-06CR Features

·Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
·Low cathode to tab capacitance (<25pF)
·International standard package
·Planar passivated chips
·Very short recovery time
·Extremely low switching losses
·Low IRM-values
·Soft recovery behaviour
·Epoxy meets UL 94V-0
·Isolated and UL registered E153432

DSEP30-06CR Typical Application

·Antiparallel diode for high frequency switching devices
·Antisaturation diode
·Snubber diode
·Free wheeling diode in converters and motor control circuits
·Rectifiers in switch mode power supplies (SMPS)
·Inductive heating
·Uninterruptible power supplies (UPS)
·Ultrasonic cleaners and welders

DSEP30-06CR datasheet

DSEP30-06CR
PDF/DataSheet Download

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