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MFG:EL Package Cooled:TO220-7


Part Number: EL2008
MFG: EL
Package Cooled: TO220-7
Description: The EL2008 is a patented high speed bipolar monolithic buffer amplifier designed to provide currents o...
MFG:EL Package Cooled:TO220-7


MFG: EL
Package Cooled: TO220-7
Description: The EL2008 is a patented high speed bipolar monolithic buffer amplifier designed to provide currents o...
The EL2008 is a patented high speed bipolar monolithic buffer amplifier designed to provide currents over 1 amp at high frequencies, while drawing only 13mA of quiescent supply current. The EL2008's 1500V/s slew rate and 55MHz bandwidth driving a 10 load is second only to the EL2009 and insures stability in fast op amp feedback loops. Elantec has applied for patents on unique circuitry within the EL2008.
Used as an open loop buffer, the EL2008's low output impedance (1) gives a gain of 0.99 when driving a 100 load and 0.9 driving a 10 load. The EL2008 has output short circuit current limiting which will protect the device under both a DC fault condition and AC operation with reactive loads.
The EL2008 is constructed using Elantec's proprietary Complementary Bipolar process that produces PNP and NPN transistors with essentially identical AC and DC characteristics. In the EL2008, the Complementary Bipolar process also insulates the package's metal heat sink tab from all supply voltages. Therefore the tab may be mounted to an external heat sink or the chassis without an insulator.
VS Supply Voltage (V+ - V-) . . . . . . . . . . . . . . . . . . . .±18V or 36V
VIN Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±15V or VS
If the input exceeds the ratings shown (or the supplies) or if the input to output voltage exceeds ±7.5V then the input current must be limited to ±50mA. See the applications section for more information.
IIN Input Current (See above note) . . . . . . . . . . . . . .. . . . ±50mA
PD Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
The maximum power dissipation depends on package type, ambient temperature and heat sinking. See the haracteristic curves for more details.
TA Operating Temperature Range . . . . . . . . . . . . . 0°C to +75°C
TJ Operating Junction Temp. . . . . . . . . . . . . . . . .. . . . . . . . 175°C
TST Storage Temp Range . . . . . . . . . . . . . . . . . -65°C to +150°C
TLD Lead Solder Temp <10 seconds . . . . . . . . . .. . . . . . . . 300°C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
EL2008
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