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MFG:FAIRCHILD  Package Cooled:SOT-363  D/C:05+  

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Part Number: FDG6318P

 

MFG: FAIRCHILD

Package Cooled: SOT-363

D/C: 05+

Description: These dual P-Channel logic level enhancement mode MOSFET are produced using Fairchild Semiconductor's ...


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FDG6318P General Description


These dual P-Channel logic level enhancement mode MOSFET are produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize on-state resistance. This device has been designed especially for low voltage  applications as a replacement for bipolar digital transistors and small signal MOSFETS.

FDG6318P Maximum Ratings

Symbol
Parameter
Ratings
Units
VDSS Drain-Source Voltage
-20
V
VGS Gate-Source Voltage
±12
V
ID Drain Current Continuous (Note 1)
Pulsed
-0.5
A
-1.8
PD Power Dissipation for Single Operation (Note 1)
0.3
W
TJ, TSTG Operating and Storage Temperature
-55 to 175

Notes:
1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RJA is determined  by the user's board design. RJA = 415°C/W when mounted on a minimum pad .

FDG6318P Features

• 0.5 A, 20 V. RDS(ON) = 780 mΩ @ VGS = 4.5 V
                           RDS(ON) = 1200 mΩ @ VGS = 2.5 V
• Very low level gate drive requirements allowing direct operation in 3V circuits (VGS(th) < 1.5V).
• Compact industry standard SC70-6 surface mount package

FDG6318P Typical Application

• Battery management

FDG6318P datasheet

FDG6318P
PDF/DataSheet Download

  • Datasheet: FDG6318P
  • File Size: 126643 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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