Purchase GS88237BB-xxxV, In-stock GS88237BB-xxxV From SeekIC.
- Table of contents:
GS88237BB-xxxV
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Suppliers
DataSheet
General Description
GS88237BB-xxxV Maximum Ratings
| Symbol | Description |
Value |
Unit |
| VDD | Voltage on VDD Pins |
0.5 to 4.6 |
V |
| VDDQ | Voltage in VDDQ Pins |
0.5 to VDD |
V |
| VI/O | Voltage on I/O Pins |
0.5 to VDDQ +0.5 ( 4.6 V max.) |
V |
| VIN | Voltage on Other Input Pins |
0.5 to VDD +0.5 ( 4.6 V max.) |
V |
| IIN | Input Current on Any Pin |
+/20 |
mA |
| IOUT | Output Current on Any I/O Pin |
+/20 |
mA |
| PD | Package Power Dissipation |
1.5 |
W |
| TSTG | Storage Temperature |
55 to 125 |
|
| TBIAS | Temperature Under Bias |
55 to 125 |
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.
GS88237BB-xxxV Features
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 1.8 V or 2.5 V core power supply
• 1.8 V or 2.5 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-bump and 165-bump BGA packages
• RoHS-compliant 119-bump and 165-bump BGA packages available
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 1.8 V or 2.5 V core power supply
• 1.8 V or 2.5 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-bump and 165-bump BGA packages
• RoHS-compliant 119-bump and 165-bump BGA packages available
GS88237BB-xxxV Typical Application
The GS88237BB/D-xxxV is a 9,437,184-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.
GS809C
PDF/DataSheet Download
- Datasheet: GS809C
- File Size: 46098 KB
- Manufacturer: VISAY [Vishay Siliconix]
- Click here to Download
- ·GS810C
- VISAY [Vishay Siliconix]
- Microprocessor Reset Monitors
- 46098 KB
- ·GS816018
- ETC [ETC]
- 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
- 829559 KB
- ·GS816018BT-150
- GSI [GSI Technology]
- 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
- 947964 KB
- ·GS816018CT-250
- GSI [GSI Technology]
- 1M x 18 and 512K x 36 18Mb Sync Burst SRAMs
- 581159 KB
- ·GS816018CT-250I
- GSI [GSI Technology]
- 1M x 18 and 512K x 36 18Mb Sync Burst SRAMs
- 581159 KB
- ·GS816018CT-250IT
- GSI [GSI Technology]
- 1M x 18 and 512K x 36 18Mb Sync Burst SRAMs
- 581159 KB
- ·GS816018CT-250T
- GSI [GSI Technology]
- 1M x 18 and 512K x 36 18Mb Sync Burst SRAMs
- 581159 KB
- ·GS816018T-133
- ETC [ETC]
- 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
- 829559 KB
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