HMC329

Features: Passive: No DC Bias RequiredInput IP3: +19 dBmLO/RF Isolation: 42 dBSmall Size: 0.47 mm2ApplicationThe HMC329 is ideal for:• LMDS• Microwave Point-to-Point Radios• SATCOMSpecifications RF / IF Input +13 dBm LO Drive +2...

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HMC329 Picture
SeekIC No. : 004363875 Detail

HMC329: Features: Passive: No DC Bias RequiredInput IP3: +19 dBmLO/RF Isolation: 42 dBSmall Size: 0.47 mm2ApplicationThe HMC329 is ideal for:• LMDS• Microwave Point-to-Point Radios• SATCOM...

floor Price/Ceiling Price

Part Number:
HMC329
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/18

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Product Details

Description



Features:

Passive: No DC Bias Required
Input IP3: +19 dBm
LO/RF Isolation: 42 dB
Small Size: 0.47 mm2



Application

The HMC329 is ideal for:
• LMDS
• Microwave Point-to-Point Radios
• SATCOM



Specifications

RF / IF Input +13 dBm
LO Drive +27 dBm
IF DC Current ±2 mA
Storage Temperature -65 to +150
Operating Temperature -55 to +85



Description

The HMC329 chip is a miniature passive double balanced mixer which can be used as an upconverter or downconverter from 25-40 GHz in a small chip area of 0.84mm x 0.55mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no DC bias. Measurements were made with the chip mounted and ribbon bonded into in a 50-ohm microstrip test fi xture that contains 5-mil alumina substrates between the chip and K-connectors. Measured data includes the parasitic effects of the assembly. RF connections to the HMC329 chip were made with 0.076 mm (3-mil) ribbon bond with minimal length <0.31mm (<12 mil).




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