Features: ·Part IdentificationHSD4M64B4-F/10 :100MHz ( CL=2)HSD4M64B4-F/10L :100MHz ( CL=3)HSD4M64B4-F/12 :125MHz ( CL=3)HSD4M64B4-F/13 :133Mhz (CL=3)* F : Auto Self-Refresh with Low Power·Burst mode operation·Auto & self refresh capability (4096 Cycles/64ms)·LVTTL compatible inputs and output...
HSD4M64B4: Features: ·Part IdentificationHSD4M64B4-F/10 :100MHz ( CL=2)HSD4M64B4-F/10L :100MHz ( CL=3)HSD4M64B4-F/12 :125MHz ( CL=3)HSD4M64B4-F/13 :133Mhz (CL=3)* F : Auto Self-Refresh with Low Power·Burst mod...
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|
PARAMETER |
SYMBOL |
RATING |
| Voltage on Any Pin Relative to Vss |
VIN ,OUT |
-1V to 4.6V |
| Voltage on Vcc Supply Relative to Vss |
Vcc |
-1V to 4.6V |
| Power Dissipation |
PD |
4W |
| Storage Temperature |
TSTG |
-55 to 150 |
| Short Circuit Output Current |
IOS |
200mA |
The HSD4M64B4 is a 4M x 64 bit Synchronous Dynamic RAM high density memory module.
The HSD4M64B4 consists of four CMOS 1M x 16 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages on a 144-pin glass-epoxy substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM.
The HSD4M64B4 is a SO-DIMM(Small Outline Dual in line Memory Module) and is intended for mounting into 144-pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications All module components may be powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible.