MFG:INTERSIL Package Cooled:DIP/SOP D/C:08+
MFG: INTERSIL
Package Cooled: DIP/SOP
D/C: 08+
Description: This N-Channel power MOSFET is manufactured using the innovative UltraFET process. This advanced process technology ...
This N-Channel power MOSFET is manufactured using the innovative UltraFET process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low-voltage bus switches, and power management in portable and batteryoperated products.
Formerly developmental type TA76113.
| Drain to Source Voltage (Note 1). . . . . . . . . . . . . VDSS | 30 | V |
| Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . .VDGR | 30 | V |
| Gate to Source Voltage . . . . . . . . . . . . VGS | ±16 | V |
| Drain Current | ||
| Continuous (TA= 25, VGS = 10V) (Figure 2)(Note 2). . . . ID |
4.7 | A |
| Continuous (TA= 100, VGS = 5V) (Note 3) . . . . . . . . . . ID | 2.7 | A |
| Continuous (TA= 100, VGS = 4.5V)(Note 3) . . .. . . . . . ID | 2.6 | A |
| Pulsed Drain Current . . . . . . .. . . . . IDM | Figure 4 | |
| Pulsed Avalanche Rating. . . . . . . . . . EAS | Figures 6 | |
| Power Dissipation(Note 2) . . . . . . . . .. . . . PD |
1.1 | W |
| Derate Above 25 . . . . . . . . . . . . . . . . . . | 0.0091 | W/ |
| Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG | -55 to 150 | |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . TL | 300 | |
| Package Body for 10s, See Techbrief 334. . . . . . . .Tpkg | 260 |
HUF76113T3ST
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