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MFG:HAR  Package Cooled:1999  

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Part Number: HUF76121SK8

 

MFG: HAR

Package Cooled: 1999

 

Description: This N-Channel power MOSFET is manufactured using the innovative UltraFET™ process. This advanced process technol...


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HUF76121SK8 General Description


This N-Channel power MOSFET is manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low-voltage bus switches, and power management in portable and batteryoperated products.

Formerly developmental type TA76121.

HUF76121SK8 Maximum Ratings

Drain to Source Voltage (Note 1). . . . . . . . . . . . . VDSS 30 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . .VDGR 30 V
Gate to Source Voltage . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TA= 25, VGS = 10V) (Figure 2) (Note 2) . . . . ID
 8 A
Continuous (TA= 100, VGS = 5V) (Note 3) . . . . . . . . . . ID 2.5 A
Continuous (TA= 100, VGS = 4.5V) (Note 3) . . . . . . . . ID 2.3 A
Pulsed Drain Current . . . . . . .. . . . . IDM Figure 4  
Pulsed Avalanche Rating. . . . . . . . . . EAS Figures 6, 17, 18  
Power Dissipation(Note 2) . . . . . . . . . . . . . . . . . PD
 2.5 W
Derate Above 25 . . . . . . . . . . . . . . . . . . 20 W/
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG -55 to 150
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . TL 300
Package Body for 10s, See Techbrief 334. . . . . . . .Tpkg 260

HUF76121SK8 Features

• Logic Level Gate Drive
• 8A, 30V
• Simulation Models
          - Temperature Compensated PSPICE™ and SABER© Electrical Models
          - Spice and SABER© Thermal Impedance Models
          - www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Related Literature
          - TB370, "Guidelines for Soldering Surface Mount Components to PC Boards"

HUF76121SK8 datasheet

HUF76121SK8
PDF/DataSheet Download

  • Datasheet: HUF76121SK8
  • File Size: 127342 KB
  • Manufacturer: INTERSIL [Intersil Corporation]
  • Click here to Download

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