MFG:IR Package Cooled:DIP16 D/C:0509+
MFG: IR
Package Cooled: DIP16
D/C: 0509+
Description: Description: The IR21592/IR21593 are complete dimming ballast controllers and 600V half-bridge drivers...
Description: The IR21592/IR21593 are complete dimming ballast controllers and 600V half-bridge drivers all in one IC. The architecture includes phase control for transformer- less lamp power sensing and regulation which minimizes changes needed to adapt non-dimming ballasts for dimming. Externally programmable features such as preheat time and current, ignition-to-dim time, and a complete dimming interface with minimum and maximum settings provide a high degree of flexibility for the ballast design engineer. Protection from failure of a lamp to strike, filament failures, thermal overload, or lamp failure during normal operation, as well as an automatic restart function, have been included in the design. The heart of this control IC is a voltagecontrolled oscillator with externally programmable minimum frequency. The IR21592/ IR21593 are available in both 16 pin DIP and 16 pin narrow body SOIC packages.
| Symbol | Definition | Min. | Max. | Units | |
| VB | High side floating supply voltage | -0.3 | 625 | V | |
| VS | High side floating supply offset voltage | VB - 25 | VB + 25 | ||
| VHO | High side floating output voltage | VS - 0.3 | VB + 0.3 | ||
| VLO | Low side output voltage | -0.3 | VCC + 0.3 | ||
| IOMAX | Maximum allowable output current (either output) due to external power transistor miller effect |
-500 | 500 | mA | |
| VVCO | Voltage controlled oscillator input voltage | -0.3 | 6.0 | A | |
| ICPH | CPH current | -5 | 5 | mA | |
| VIPH | IPH voltage | -0.3 | 5.5 | V | |
| VDIM | Dimming control pin input voltage | -0.3 | 5.5 | ||
| VMAX | Maximum lamp power setting pin input voltage | -0.3 | 5.5 | ||
| VMIN | Minimum lamp power setting pin input voltage | -0.3 | 5.5 | ||
| VCS | Current sense input voltage | -0.3 | 5.5 | ||
| ISD | Shutdown pin current | -5 | 5 | mA | |
| ICC | Supply current (note 1) | - | 25 | ||
| dV/dt | Allowable offset voltage slew rate | -50 | 50 | V/ns | |
| PD | Package power dissipation @ TA +25 PD = (TJMAX-TA)/RthJA |
(16 pin DIP) | - | 1.60 | W |
| (16 pin SOIC) | - | 1.25 | |||
| RthJA | Thermal resistance, junction to ambient | (16 pin DIP) | - | 75 | /W |
| (16 pin SOIC) | - | 115 | |||
| TJ | Junction temperature | -55 | 150 | ||
| TS |
Storage temperature | -55 | 150 | ||
| TL | Lead temperature (soldering, 10 seconds) | - | 300 | ||
IR21593
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