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MFG:720 Package Cooled:IR


Part Number: IR2161S
MFG: 720
Package Cooled: IR
Description: The IR2161 is a dedicated Intelligent Half bridge Driver IC for a Halogen convertor (electronic transf...
MFG:720 Package Cooled:IR


MFG: 720
Package Cooled: IR
Description: The IR2161 is a dedicated Intelligent Half bridge Driver IC for a Halogen convertor (electronic transf...
The IR2161 is a dedicated Intelligent Half bridge Driver IC for a Halogen convertor (electronic transformer). It includes all necessary protection features and also allows the Convertor to be dimmed externally with a standard phase cut dimmer with both leading or trailing edge types. This IC provides the advantage of reduced thermal stress in the lamp due to softstart. There is also compensation of the output voltage for load regulation.It enables the convertor to operate with extremely low harmonic distortion over the full range of loads. The IR2161 includes adaptive deadtime to allow cool running MOSFETs and improves the EMI behaviour due to frequency modulation (dither). All the features are integrated in a small 8 pin DIP/SOIC package to allow for a size reduction in the next generation of convertors.
|
Symbol |
Definition |
Min. |
Max. |
Units |
|
VB |
High side floating supply voltage |
-0.3 |
625 |
V |
|
VS |
High side floating supply offset voltage |
VB - 25 |
VB + 0.3 | |
|
VHO |
High side floating output voltage |
VS - 0.3 |
VB + 0.3 | |
|
VLO |
Low side output voltage |
-0.3 |
VCC + 0.3 | |
|
IOMAX |
Maximum allowable output current (HO,LO) due to external power transistor miller effect |
-500 |
500 |
mA |
|
VCSDMAX |
CSD pin voltage |
-0.3 |
VCC + 0.3 |
V |
|
VCS |
Current sense pin voltage |
-0.3 |
VCC + 0.3 | |
|
ICS |
Current sense pin current |
-5 |
5 |
mA |
|
ICC |
Supply current (Note 1) |
-20 |
20 | |
|
dV/dt |
Allowable offset voltage slew rate |
-50 |
50 |
V/ns |
|
PD |
Maximum power dissipation @ TA +25°C (8 Lead DIP) |
- |
1 |
W |
|
PD = (TJMAX-TA)/RthJA (8 Lead SOIC) |
- |
0.625 | ||
|
RthJA |
Thermal resistance, junction to ambient (8 Lead DIP) |
- |
125 |
°C/W |
|
(8 Lead SOIC) |
- |
200 | ||
|
TJ |
Junction temperature |
-55 |
150 |
°C |
|
TS |
Storage temperature |
-55 |
150 | |
|
TL |
Lead temperature (soldering, 10 seconds) |
- |
300 |
IR2010
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