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Part Number: IRF7316QPbF
Description: Specifically designed for Automotive applications, these HEXFET® Power MOSFET's in a Du...


Description: Specifically designed for Automotive applications, these HEXFET® Power MOSFET's in a Du...
Specifically designed for Automotive applications, these HEXFET® Power MOSFET's in a Dual SO-8 package utilize the lastest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of these Automotive qualified HEXFET Power MOSFET's are a 150 junction operating temperature, fast switching speed and improved repetitive avalanche rating. These benefits combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
The efficient SO-8 package provides enhanced thermal characteristics and dual MOSFET die capability making it ideal in a variety of power applications. This dual, surface mount SO-8 can dramatically reduce board space and is also available in Tape & Reel.
| Characteristic | Symbol | Value | Units | |
| Drain-source voltage | VDS | ?20 | V | |
| Gate-source voltage | VGS | ±12 | V | |
| Continuous Drain Current | TA=25 | ID | -4.9 | A |
| TA=70 | -3.9 | |||
| Pulsed Drain Current | IDM | -30 | ||
| Continuous Source Current (Diode Conduction) | IS | -2.5 | ||
|
Maximum Power Dissipation |
TA=25 | PD | 0.58 | W |
| TA=70 | 0.36 | |||
| Single-pulse avalanche energy | EAS | 6.5 | mJ | |
| Avalanche current | IAR | -5 | A | |
| Repetitive Avalanche Energy |
EAR | 0.20 | mJ | |
| Peak Diode Recovery dV/dt | dV/dt | -5.0 | V/ns | |
| Junction and Storage Temperature Range | TJ, TSTG | - 55 to +150 | ||
` Advanced Process Technology
` Ultra Low On-Resistance
` Dual P- Channel MOSFET
` Surface Mount
` Available in Tape & Reel
` 150 Operating Temperature
` Automotive [Q101] Qualified
` Lead-Free
IRF034
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