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Part Number: IRF7343QPBF

 

 

 

 

Description: Specifically designed for Automotive applications, these HEXFET® Power MOSFET's in a Du...


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IRF7343QPBF General Description


Specifically designed for Automotive applications, these HEXFET® Power MOSFET's in a Dual SO-8 package utilize the lastest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of these Automotive qualified HEXFET Power MOSFET's are a 150 junction operating temperature, fast switching speed and improved repetitive avalanche rating. These benefits combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.

The efficient SO-8 package provides enhanced thermal characteristics and dual MOSFET die capability making it ideal in a variety of power applications. This dual, surface mount SO-8 can dramatically reduce board space and is also available in Tape & Reel.

IRF7343QPBF Maximum Ratings

  Parameter Max. Units
N-Channel P-Channel
VDS

VGS
Drain-to-Source Voltage

Gate-to-Source Voltage
55

±20
-55

±20
V
ID @ TA = 25

ID @ TA = 70

IDM
Continuous Drain Current, VGS @ 10V

Continuous Drain Current, VGS @ 10V

Pulsed Drain Current
4.7

3.8

38
-3.4

-2.7

-2.7
A


PD @ TA = 25

PD @ TC = 70
Maximum Power Dissipation

Maximum Power Dissipation
2.0

1.3
W
EAS

IAR

EAR
Single-pulse avalanche energy

Avalanche current

Repetitive avalanche energy
7.2

4.7

0.20
114

-3.4

0.20
mJ

A

mJ
dv/dt Peak Diode Recovery dv/dt 5.0 -5.0 V/ns
TJ, TSTG
Junction and Storage Temperature Range -55 to +150

IRF7343QPBF Features

`Advanced Process Technology
`Ultra Low On-Resistance
`Dual N and P Channel MOSFET
`Surface Mount
`Available in Tape & Reel
`150 Operating Temperature
`Automotive [Q101] Qualified
`Lead-Free

IRF7343QPBF datasheet

IRF034
PDF/DataSheet Download

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