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IRF7350

Features: *Ultra Low On-Resistance* Dual N and P Channel MOSFET* Surface Mount* Available in Tape and ReelPinoutSpecifications Parameter Max. Units N-Channel P-Channel VSD Drain-to-Source Voltage 100 -100 A ID @ TA = 25 Continuous Drain Current, V GS @ 10V 2.1 -1.5 ID ...

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SeekIC No. : 004376744 Detail

IRF7350: Features: *Ultra Low On-Resistance* Dual N and P Channel MOSFET* Surface Mount* Available in Tape and ReelPinoutSpecifications Parameter Max. Units N-Channel P-Channel VSD Drain-to-...

IRF7350 Data Sheet

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Part Number:
IRF7350
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

*Ultra Low On-Resistance
* Dual N and P Channel MOSFET
* Surface Mount
* Available in Tape and Reel




Pinout

Connection Diagram




Specifications

Parameter Max. Units
N-Channel P-Channel
VSD Drain-to-Source Voltage 100 -100 A
ID @ TA = 25 Continuous Drain Current, V GS @ 10V 2.1 -1.5
ID @ TA = 70 Continuous Drain Current, V GS @ 10V 1.7 -1.2
IDM Pulsed Drain Current 8.4 -6.0
PD @TA = 25 Power Dissipation 2.0 W
Linear Derating Factor 0.016 W/
EAS Single Pulse Avalanche Energy 35 51 mJ
VGS Gate-to-Source Voltage ± 20 ± 20 V
dv/dt Peak Diode Recovery dv/dt 4.0 4.3 V/ns
TJ, TSTG Junction and Storage Temperature Range -55 to + 150





Description

These dual N and P channel HEXFET® power MOSFETs IRF7350 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET® power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in DC motor drives and load management applications.

The SO-8 IRF7350 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.






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