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MFG:IOR  Package Cooled:TO252  

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Part Number: IRFR3303

 

MFG: IOR

Package Cooled: TO252

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRFR3303 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D-Pak is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.

IRFR3303 Maximum Ratings

Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
33
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
21
IDM Pulsed Drain Current
120
PD @TC = 25°C Power Dissipation
57
W
Linear Derating Factor
0.45
W/°C
VGS Gate-to-Source Voltage
± 20
V
EAS Single Pulse Avalanche Energy
95
mJ
IAR Avalanche Current
18
A
EAR Repetitive Avalanche Energy
5.7
mJ
dv/dt Peak Diode Recovery dv/dt
5.0
V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
°C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRFR3303 Features

 Ultra Low On-Resistance
 Surface Mount (IRFR3303)
 Straight Lead (IRFU3033)
Advanced Process Technology
 Fast Switching
 Fully Avalanche Rated

IRFR3303 datasheet

IRFR3303
PDF/DataSheet Download

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