Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· Lower Leakage Current: 10mA (Max.) @ VDS = 60V· Lower RDS(ON): 0.097W (Typ.)Specifications Symbol Characteristic Value Units VDSS Drain-to...
IRFR/U014A: Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance· Improved Gate Charge· Extended Safe Operating Area· Lower Leakage Current: 10mA (Max.) @ VDS = 60V· Lo...
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Application Surface Mount (IRFR120N)Straight Lead (IRFU120N)Advanced Process Technology Fast Switc...
Features: · Avalanche Rugged Technology· Rugged Gate Oxide Technology· Lower Input Capacitance·I m...
| Symbol | Characteristic | Value | Units |
| VDSS | Drain-to-Source Voltage | 60 | V |
| ID | Continuous Drain Current (TC=25°C) | 8.2 | A |
| Continuous Drain Current (TC=100°C) | 5.2 | A | |
| IDM | Drain Current-Pulsed (1) | 33 | A |
| VGS | Gate-to-Source Voltage | ±20 | V |
| EAS | Single Pulsed Avalanche Energy (2) | 58 | mJ |
| IAR | Avalanche Current (1) | 8.2 | A |
| EAR | Repetitive Avalanche Energy (1) | 1.8 | mJ |
| dv/dt | Peak Diode Recovery dv/dt (3) | 5.5 | V/ns |
| PD | Total Power Dissipation (TA=25) * | 2.5 | W |
| Total Power Dissipation (TC=25) Linear Derating Factor |
18 0.14 |
W W/ | |
| TJ , TSTG | Operating Junction and Storage Temperature Range |
- 55 to +150 | |
| TL | Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds |
300 |