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IRFR

Features: · Ultra Low On-Resistance· P-Channel· Surface Mount (IRFR5505)· Straight Lead (IRFU5505)· Advanced Process Technology· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ -10V -18 A ID @ TC = ...

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SeekIC No. : 004377318 Detail

IRFR: Features: · Ultra Low On-Resistance· P-Channel· Surface Mount (IRFR5505)· Straight Lead (IRFU5505)· Advanced Process Technology· Fast Switching· Fully Avalanche RatedSpecifications Paramete...

IRFR Data Sheet

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Part Number:
IRFR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

· Ultra Low On-Resistance
· P-Channel
· Surface Mount (IRFR5505)
· Straight Lead (IRFU5505)
· Advanced Process Technology
· Fast Switching
· Fully Avalanche Rated


Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ -10V
-18
A
ID @ TC = 100°C Continuous Drain Current, VGS @ -10V
-11
IDM Pulsed Drain Current
-64
PD @TC = 25°C Power Dissipation
57
W
  Linear Derating Factor
0.45
W/
VGS Gate-to-Source Voltage
20
V
EAS Single Pulse Avalanche Energy
150
mJ
IAR Avalanche Current
-9.6
A
EAR Repetitive Avalanche Energy
5.7
mJ
dv/dt Peak Diode Recovery dv/dt
-5.0
V/ns
TJ
TSTG		 Operating Junction and Storage Temperature Range
-55to+150
  Soldering Temperature, for 10 seconds
300 (1.6mm from case)



Description

Fifth Generation HEXFETs of the IRFR from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit,combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D-Pak of the IRFR is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.




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