IRFR9220 Maximum Ratings
IRFR9220, IRFU9220 UNITS
Drain to Source Voltage . . . . . . . . . . . . . . . . VDSS -200 V
Drain to Gate Voltage. . . . . . . . . . . . . . . . . .VDGR -200 V
Gate to Source Voltage . . . . . . . . . . . . . . . . VGS ±20 V
Continuous Drain Current . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . .IDM 3.6 A
Refer to Peak Current Curv
Single Pulse Avalanche Rating . . . . . . . . . . . .EAS Refer to UIS Curve
Power Dissipation . . . . . . . . . . . . . . . . . . . . .PD 4.2 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.33 W/
Operating and Storage Temperature . . . . . . .TJ, TSTG -55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300
Package Body for 10s, See Techbrief 334 . . . Tpkg 260
IRFR9220 Features
• 3.6A, 200V
• rDS(ON) = 1.500Ω
• Temperature Compensating PSPICE® Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount
Components to PC Boards"
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