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Part Number: IRL1404ZPbF
Description: Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest p...


Description: Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest p...
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
| Parameter |
Max. |
Units | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Silicon Limited) |
180 |
A |
| ID @ TC =100 |
Continuous Drain Current, VGS @ 10V |
130 | |
| ID @ TC = 25 | Continuous Drain Current,VGS @ 10V (Package Limited) |
75 | |
| IDM | Pulsed Drain Current |
790 | |
| PD @TC= 25 | Power Dissipation |
200 |
W |
| Linear Derating Factor |
1.3 |
W/ | |
| VGS | Gate-to-Source Voltage |
±16 |
V |
| EAS (Thermally limited) | Single Pulse Avalanche Energy |
190 |
|
| EAS (Tested ) | Single Pulse Avalanche Energy Tested Value |
490 |
mJ |
| IAR | Avalanche Current |
See Fig.12a, 12b, 15, 16 |
A |
| EAR | Repetitive Avalanche Energy |
mJ | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
|
| Reflow Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) | ||
| Mounting Torque, 6-32 or M3 screw |
10 lbf`in (1.1N`m) |
IRL1004
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